Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
XLSEMI XL7026E1
Configuration
1 options
Configuration
Electronic Component
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- XLSEMI XL7026E1
- Type
- XLSEMI
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- XLSEMI
- Electronic Component
- XL7026E1
- Electronic Component
- 1
- Package
- SOP-8-EP
- Electronic Component
- DC-DC Power Supply IC
- Electronic Component
- 0.233g
- Electronic Component
- 1
- Features
- Electronic Component
- Type
- Electronic Component
- Synchronous
- Electronic Component
- Electronic Component
- BM0230126498
- Operating Voltage
- 16V~90V
- Switching Frequency
- 150kHz
- Electronic Component
- Electronic Component
- Output Voltage
- 1.25V~20V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
XL7026E1 产品概述
一、产品简介
XL7026E1 是一款由中国品牌 XLSEMI（芯龙）推出的高性能 DC-DC 降压型电源芯片，封装采用 SOP-8-EP 封装形式。这款芯片专为需要高效率、小体积、高稳定性的应用场景而设计，包括但不限于消费电子、通信设备、工业控制等领域。XL7026E1 以其优越的性能和可靠性，成为了现代电子设计中的一款理想解决方案。
二、主要特性
- 高效率：XL7026E1 具有高达95%的转换效率，确保在降低功耗的同时有效延长设备的使用寿命。
- 低静态电流：该芯片在待机模式下的静态电流极低，有效降低系统功耗，特别适合便携式及电池供电的设备。
- 宽输入电压范围：XL7026E1的输入电压范围广，通常在4.5V至30V范围内，适合多种不同的电源配置。
- 输出电流能力：提供高达3A的持续输出电流，充分满足各种负载要求，无论是轻负载还是重负载场景。
- 温度保护：内置过温保护功能，能够自动监测芯片的工作温度，防止因过热造成的损害。
- 短路保护：在短路情况下，能够及时进入保护模式，减少对电源和后级设备造成的潜在伤害。
三、应用领域
XL7026E1 的应用场景非常广泛，适用于：
- 消费电子：如手机、平板电脑、便携式音响等各种终端产品。
- 通信设备：如路由器、交换机、基站等，执行高效的电源转换。
- 电力工具及家电：如无线吸尘器、电动工具等，确保设备在高负载下稳定工作。
- 工业控制：如自动化设备中电源管理，实现高效的功率转换。
四、典型电路设计
在设计电路时，XL7026E1 可以与外部电感、电容配合，形成一个完整的降压电源。一般来说，设计者需要根据负载类型和工作条件选择合适的外部元件，以实现最佳性能。例如：
- 电感选择：需要根据输出电流和频率选择合适的电感规格，通常推荐使用低直流电阻的电感，以降低功率损耗。
- 输入/输出电容：选择高品质的电容可以确保输出电压稳定，尤其在负载突变时。
- 反馈网络：使用电阻分压器来设置输出电压，确保电压符合预期。
五、总结
XL7026E1 是一款强大的降压型 DC-DC 转换芯片，其高效率、低功耗等特性使其在众多应用中都表现优异。其合理的封装设计和丰富的保护功能，使得该芯片在电子元器件市场上竞争力强劲。无论是在消费电子还是工业控制方面，XL7026E1 都能以其可靠的性能和灵活的应用满足设计师的需求，是现代电子设计中不可或缺的一部分。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
