WMSIC Electronic Components

XLSEMI XL9023

ModelXL9023
PackageTO-252-5L
BrandXLSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XLSEMI XL9023
Type
XLSEMI
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XLSEMI
Electronic Component
XL9023
Electronic Component
1
Package
TO-252-5L
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.398g
Electronic Component
1
Features
Electronic Component
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0264599104
Operating Temperature
40℃~+125℃
Operating Voltage
5V~40V
Switching Frequency
96kHz~144kHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL9023 产品概述

一、简介

XL9023 是一款同步整流、降压型(Buck)开关稳压器,集成高侧与低侧功率开关,适用于宽输入电压范围的降压稳压应用。器件支持输入电压 5V~40V,输出可调 1.25V~35V,最大输出电流 4A,典型开关频率约 120kHz(范围 96kHz~144kHz),工作温度范围 -40℃~+125℃。封装为 TO-252-5L,适合中功率、高密度的电源方案。

二、主要规格与特性

  • 功能类型:降压(Buck)同步整流型
  • 输入电压:5V ~ 40V
  • 输出电压:1.25V ~ 35V(外部电阻分压可调)
  • 最大输出电流:4A(在散热和工作条件允许下)
  • 开关频率:96kHz ~ 144kHz(典型 120kHz)
  • 同步整流:内置同步 MOSFET(无需外接肖特基二极管)
  • 静态电流(Iq):约 2.3mA(静态工作或轻载空载时的偏置电流)
  • 过流保护:内置过流保护机制,提升系统可靠性
  • 工作温度:-40℃ ~ +125℃
  • 封装:TO-252-5L(带散热底板,便于 PCB 散热)
  • 输出通道数:单通道(1 路)
  • 开关管:内置功率开关,简化外围布局和 BOM

三、功能与应用场景

XL9023 适用于车载、工业控制、通信设备、仪器仪表、分布式电源及各种需要从较高电压降压到中低压并且需高效率和小尺寸的场合。典型应用包括:

  • 汽车电子(12V / 24V 到点式供电)
  • 工业电源模块
  • 嵌入式系统主电源或从电源
  • 电池组降压管理(符合输入电压范围)

四、器件优势与设计要点

  • 同步整流:内置低 Rds(on) 下桥 MOSFET,提高效率,尤其在大电流输出时减少整流损耗。
  • 宽输入电压:支持 5–40V,可直接用于 12V、24V 等常见母线系统。
  • 低静态电流:2.3mA 的静态电流有利于降低待机功耗(具体空载行为仍以数据手册为准)。
  • 中等开关频率(约 120kHz):在效率与外设体积之间取得平衡,允许使用相对小体积的电感与电容。
  • 过流保护:提高系统的可靠性与安全性,防止故障状态下器件或负载损坏。

设计时需注意:在高 Vin、接近最大输出电流工作时,开关和导通损耗都会显著增大,需良好散热(大面积铜箔、连接散热片或使用热沉)以保证器件在安全温升内工作。

五、典型外设与布局建议

  • 输入侧:使用低 ESR 大容量电解/固体电容与陶瓷旁路电容相结合,靠近 VIN 和 GND 引脚放置以抑制瞬态电压。
  • 开关节点(SW):布线尽量短,减小环路面积以降低 EMI;输出电感与 SW、输出电容靠近放置以减小电流回路。
  • 输出侧:选择低 ESR 输出电容以降低输出纹波和提升瞬态响应;同步整流降低肖特基损耗,但仍推荐在高纹波环境下评估输出电容的热特性。
  • 热管理:TO-252-5L 的金属底板应和 PCB 大面积散热铜箔相连,并通过过孔导通到背面散热层;在 4A 工况和高 Vin 时建议评估热阻并加强散热。
  • 布局注意:短而粗的 VIN/GND 回流路径,SW 节点与敏感 PCB 区域隔离,反馈(FB)走短而屏蔽良好的路线,避免噪声耦合导致稳压不稳。

六、引脚功能(通用说明)

XL9023 为 5 引脚 TO-252-5L 封装(具体引脚排列以器件数据手册为准),常见引脚功能包括:

  • VIN:电源输入
  • SW:开关节点,连接电感与输出滤波网络
  • GND:地(电源与信号地)
  • FB:反馈输入,用于设定输出电压(外接电阻分压)
  • EN/UVLO(或类似):使能/欠压锁定引脚(如器件有该功能)

具体引脚名称与功能请以正式数据手册为准,设计时应严格按照芯片手册的引脚定义与电气参数。

七、注意事项与可靠性

  • 在高 Vin 并大电流输出时,注意器件功耗与结壳温度,必要时采取外部散热措施。
  • 选择合适的电感满足电流峰值和饱和电流要求,避免饱和导致控制环路不稳定或过流触发。
  • 验证系统在不同输入/输出/负载以及温度条件下的热稳定性和保护动作。
  • 布局与走线对 EMI、环路稳定性和输出纹波有显著影响,建议在样机阶段进行 EMC 与热性能验证。

结语:XL9023 面向需在宽输入电压下输出可调中低压并要求较高效率与中等开关频率的单路降压应用,内置同步开关与过流保护,TO-252-5L 封装便于实现紧凑且具有良好散热的电源模块设计。请在最终设计与量产前参照 XLSEMI 官方数据手册和参考设计进行详细验证。

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