Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
XLSEMI XL2013E1
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- XLSEMI XL2013E1
- Type
- XLSEMI
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- XLSEMI
- Electronic Component
- XL2013E1
- Electronic Component
- 1
- Package
- TO-252-5
- Electronic Component
- DC-DC Power Supply IC
- Electronic Component
- 0.627g
- Electronic Component
- 1
- Type
- Electronic Component
- Synchronous
- Electronic Component
- Electronic Component
- BM0000003167
- Operating Temperature
- 40℃~+125℃
- Operating Voltage
- 8V~40V
- Switching Frequency
- 150kHz
- Electronic Component
- Electronic Component
- Output Voltage
- 5V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
XL2013E1 产品概述
一、概述
XL2013E1是由知名电源管理芯片制造商XLSEMI（芯龙）推出的一款高性能降压型DC-DC电源转换器。该芯片采用TO-252-5封装，专为高效能和小尺寸设计而优化，广泛应用于便携式电子设备、通信设备、家电、以及其他需要稳定电源的场合。XL2013E1具有高达90%的转换效率，并能够在多种条件下维持稳定的输出电压，保证用户设备的高效运行。
二、产品特性
降压转换：XL2013E1能够将高输入电压有效转换为所需的较低输出电压，支持最大输入电压可达28V，适用于多种电源环境。
高效能：该芯片采用了高效的PWM控制技术，最低待机功耗和高达90%的转换效率，确保在不同负载下均可实现最佳的电源管理。
出色的负载与线性调整率：XL2013E1提供极低的负载调整率（Load Regulation）和线性调整率（Line Regulation），大限度地减少输出电压波动，满足高性能设备对电源的严格要求。
宽广的工作温度：该芯片的工作温度范围为-40℃至+85℃，适合在多种工作环境下使用，特别是需要高温或低温的应用。
保护功能：内置多种保护机制，包括过流保护、短路保护和过热保护，确保芯片在不可预见的情况下仍然能保持较高的可靠性和稳定性。
简化设计：XL2013E1的设计极为简洁，用户可以通过简单布局实现降压电源设计，减少了外部元件需求，节省了PCB空间。
三、应用场合
XL2013E1因其出色的性能和特性，适用于广泛的应用场合，包括但不限于：
便携式电子设备：如智能手机、平板电脑和手持设备，需求高效能和小体积的电源管理解决方案。
通信设备：可以为路由器、交换机等设备提供稳定的电源，保证信息传输的高效与稳定。
工业自动化：在工控设备与机械自动化中提供高可靠的电源支持，确保设备的连续运行。
家用电器：适用于各种智能家居产品，比如智能锁、智能音响等，提升设备的智能化水平与用户体验。
四、封装与引脚排列
XL2013E1采用TO-252-5封装，其引脚排列设计合理，便于焊接和布局，特别适合于多层PCB设计。TO-252-5封装的优势在于其良好的散热性能，有效提升芯片的稳定性和使用寿命。同时，封装小巧使得其在空间有限的设计中表现出较高的灵活性。
五、总结
作为一款高效、功能全面的降压型DC-DC电源芯片，XL2013E1充分展示了现代电源管理技术的先进性。无论是用于移动设备还是在工业应用中，XL2013E1都能提供卓越的性能和高可靠性，为设计师和开发者解决电源管理问题提供了极大的便利。无疑，XL2013E1是各类电子产品不可或缺的重要组成部分，助力未来电子技术的先进和发展。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
