WMSIC Electronic Components

XLSEMI XL4301E1

ModelXL4301E1
PackageSOIC-8-EP
BrandXLSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XLSEMI XL4301E1
Type
XLSEMI
Minimum package
4000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XLSEMI
Electronic Component
XL4301E1
Electronic Component
1
Package
SOIC-8-EP
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.202g
Electronic Component
1
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0230008727
Operating Temperature
40℃~+125℃
Operating Voltage
8V~40V
Switching Frequency
180kHz
Electronic Component
Electronic Component
Output Voltage
1.25V~38V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL4301E1 产品概述

一、产品简介

XL4301E1 是 XLSEMI(芯龙)推出的一款内置开关管的降压型 DC-DC 稳压芯片,单通道、可调输出,适用于输入电压宽范围的降压转换场合。器件工作电压范围 8V 到 40V,输出可调 1.25V 到 38V,最大输出电流 2.5A,开关频率 180kHz,静态电流仅 2mA,工作温度 -40℃ 至 +125℃。采用 SOIC-8-EP 封装,集成功率开关管,简化外围设计。

二、主要特性

  • 宽输入电压:8V ~ 40V,适合汽车、工业及宽压源系统。
  • 可调输出:1.25V ~ 38V,灵活满足不同负载需求。
  • 输出电流:最大 2.5A(受散热与外围元件影响,需按实际应用确认)。
  • 开关频率:180kHz,在效率与外部元件尺寸间取得平衡。
  • 低静态电流:Iq = 2mA,有利于待机及轻载能耗控制。
  • 非同步整流(异步):需外接肖特基二极管,电路简单但效率略低于同步整流方案。
  • 封装:SOIC-8-EP,底部敷铜散热通道,便于 PCB 散热设计。

三、典型应用场景

  • 汽车电子(车载传感、辅助电源,需注意汽车环境及集成保护)
  • 工业电源模块(传感器、控制器供电)
  • 通信设备辅助电源
  • 通用 8–40V 到低压域的点对点电源转换

四、设计与选型建议

  • 电感:根据工作点和允许电流纹波选择。以 12V→5V、Iout=2.5A 为例,若取电流纹波 30%(≈0.75A),L ≈ (Vin−Vout)·D/(ΔI·Fs) 可得约 15–25µH 范围,实际可选 10–25µH,注意电感饱和电流需高于峰值电流(≥3A)。
  • 二极管:选用肖特基二极管,耐压 ≥ 输入最大 40V,平均/脉冲电流能承受输出电流及回路峰值,低正向压降有利于提高效率。
  • 输出电容:优先使用低 ESR 的陶瓷电容配合固态/电解滤波电容以兼顾瞬态和纹波;容量与 ESR 对环路稳定性影响较大,请参考原厂环路补偿建议。
  • 输入电容:靠近 VIN 和 GND 放置低 ESR 电容,以抑制输入纹波并提高稳定性。
  • 开关频率 180kHz,元件尺寸相对较小,但高 VIN 大压差时器件损耗增大,应兼顾散热设计。

五、封装与热管理

SOIC-8-EP 带裸露散热垫,建议将 exposed pad 焊接到 PCB 大面积铜箔并使用多孔热通或多层铜平面导热,必要时在散热区加热导孔通到反面铜层。在高输入电压或接近额定输出电流时,器件功耗显著,应计算功耗并保证结温在器件允许范围内。

六、注意事项

  • 由于为异步整流结构,效率在高电流时受肖特基压降影响,关键应用可评估是否采用同步方案。
  • 环路补偿、输出滤波元件对稳定性影响较大,建议按参考电路和布局规范设计并做实际负载与瞬态测试。
  • 在汽车和工业场景,建议增加输入反向连接保护、输入浪涌抑制及适当的 EMI 滤波。

XL4301E1 以其宽输入范围、可调输出与内置开关管的集成度,适用于对设计板级空间、外围复杂度有要求且输入电压变化大的降压电源应用。实际设计时应结合完整数据手册与 PCB 热设计规则,确保可靠与稳定运行。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.