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XLSEMI XL8002E1
Configuration
1 options
Configuration
21+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- XLSEMI XL8002E1
- Type
- XLSEMI
- Minimum package
- 800 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- XLSEMI
- Electronic Component
- XL8002E1
- Electronic Component
- 1
- Package
- TO-263-5
- Electronic Component
- LEDDriver
- Electronic Component
- 2.114g
- Electronic Component
- 1
- Channel Count
- 1
- Features
- Built-in; (OTP)
- Electronic Component
- BM0264599105
- Operating Temperature
- 40℃~+125℃
- Switching Frequency
- 102kHz~152kHz
- Electronic Component
- Electronic Component
- Output Current
- 300mA
- Operating Voltage(DC)
- 12V~80V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
XL8002E1 LED驱动芯片产品概述
一、产品定位与典型应用场景
XL8002E1是芯龙半导体（XLSEMI）推出的单通道降压型LED驱动芯片，专为中小功率LED照明/显示场景设计，凭借宽电压、宽温范围及内置保护功能，适配多类严苛环境需求。典型应用包括：
- 汽车领域：内饰氛围灯、牌照灯、小功率尾灯；
- 工业场景：LED状态指示屏、设备指示灯；
- 户外/家电：小功率景观灯、家电背光/按键灯；
覆盖12V~80V直流电压的主流应用场景，无需额外电压转换即可驱动LED。
二、核心电气参数解析
芯片关键参数直接决定其适配场景与性能表现，核心参数如下：
- 电压范围：DC 12V~80V，兼容汽车12V/24V电瓶、工业24V/48V系统，适配多类电源环境；
- 开关频率：102kHz~152kHz，处于低EMI区间，既避免高频干扰，又能减小外围电感/电容体积；
- 输出能力：单通道300mA恒定电流输出，适配3~8颗3V LED串联（总电压需低于输入电压），满足中小功率LED串需求；
- 拓扑结构：采用降压（Buck）拓扑，效率典型值超90%，适合输入电压高于LED串总电压的场景；
- 工作温度：-40℃~+125℃，符合车规级宽温要求，可在北方冬季、汽车引擎舱等极端环境稳定工作；
- 开关管设计：内置高压开关管，无需外部功率管，简化电路、降低BOM成本。
三、核心保护功能保障可靠性
LED驱动需长期稳定工作，XL8002E1内置两大关键保护，避免故障损坏：
- 过流保护（OCP）：输出电流超过内置阈值时，自动启动限流或关断模式，防止LED过流烧毁，重启后恢复正常；
- 过温保护（OTP）：芯片结温超150℃左右时，降低输出功率或关断，温度回落至安全范围后自动恢复，避免芯片过热损坏。
四、封装与设计优势
芯片采用TO-263-5贴片封装，特点如下：
- 体积紧凑（6.5mm×8.0mm×2.3mm），适合高密度PCB布局，满足小型化产品需求；
- 5引脚设计简化外围电路，仅需少量电感、电容即可实现驱动，降低设计复杂度；
- 封装散热性能良好，配合宽温设计，保障极端环境下的热稳定性。
五、应用设计注意事项
- 输入电压适配：需稳定在12V~80V之间，低于12V或高于80V会导致芯片无法工作；
- LED串配置：LED串总电压需低于输入电压（降压拓扑要求），总电流匹配300mA，避免串并联不均；
- 外围元件选型：电感选低ESR功率电感，电容适配开关频率，减少EMI干扰；
- 散热设计：高温环境下（如+125℃），PCB需增加散热铜箔辅助散热。
XL8002E1凭借高集成度、宽适配性及可靠保护，成为中小功率LED驱动的高性价比选择，尤其适合对体积、环境适应性要求较高的场景。
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