WMSIC Electronic Components

XLSEMI XL9004E1

ModelXL9004E1
PackageSOP-8
BrandXLSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XLSEMI XL9004E1
Type
XLSEMI
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XLSEMI
Electronic Component
XL9004E1
Electronic Component
1
Package
SOP-8
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.114g
Electronic Component
1
Features
Electronic Component
Type
Electronic Component
Electronic Component
BM0264555981
Operating Temperature
40℃~+125℃@(TA)
Operating Voltage
5V~45V
Switching Frequency
200kHz
Electronic Component
Electronic Component
Output Voltage
1.25V~40V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL9004E1 产品概述

一、概述

XL9004E1 是一款高效率同步整流降压型(Buck)DC-DC开关转换器,集成高性能开关管与环路补偿模块,适用于对体积、成本和效率有较高要求的电源方案。器件工作开关频率为恒定 200kHz,支持宽输入电压范围 5V 至 45V,输出电压可设定在 1.25V 至 40V,最大输出电流可达 2.0A,且可工作在 -40℃ 到 +125℃(TA)温度范围内,封装为 SOP-8,品牌:XLSEMI(芯龙)。

二、主要特性

  • 宽输入电压:5V ~ 45V,适配汽车、工业及通信类供电场景。
  • 宽输出电压:1.25V ~ 40V,可实现从低压到中高压的稳压输出。
  • 输出电流能力:最高 2.0A,满足中小功率负载需求。
  • 恒定开关频率:200kHz,有利于滤波器元件选型与电磁兼容设计。
  • 同步整流:内部集成同步开关,提高转换效率,降低功耗。
  • 最大占空比:支持接近 100% 输出,适合输入电压接近输出电压时的低压差工作。
  • 低静态电流:Iq ≈ 3mA,降低空载或轻载下的待机功耗。
  • 内置环路补偿模块:减少外部元件数量,简化系统设计,缩小 PCB 占用面积。
  • 多重保护:内置热关断、输出限流、短路保护等可靠性功能;在短路保护启用时,开关频率由 200kHz 降至约 30kHz。

三、性能参数(概要)

  • 功能类型:降压型(Buck)
  • 输入电压范围:5V ~ 45V
  • 输出电压范围:1.25V ~ 40V
  • 输出电流:2A(最大)
  • 开关频率:200kHz(正常工作);短路保护时降至约 30kHz
  • 工作温度:-40℃ ~ +125℃(TA)
  • 拓扑结构:降压式(同步整流)
  • 静态电流 Iq:约 3mA
  • 开关管:内置
  • 封装:SOP-8

四、功能保护与工作模式

XL9004E1 提供完善的保护机制以提高系统可靠性:

  • 输出限流保护(OCP):在过流条件下限制输出电流,保护器件与负载。
  • 短路保护(SCP):当发生短路时自动进入保护,并将开关频率从 200kHz 降至约 30kHz,以降低能量传输并方便故障恢复。
  • 热关断(TSD):器件温度过高时自动关断,避免因温度导致的损坏。
    此外,芯片支持恒压(CV)与恒流(CC)两种环路工作模式,适用于电源与电池充电类应用。

五、典型应用

  • 汽车电子辅助电源(车载电子、传感器电源)
  • 工业控制与自动化设备电源
  • 通信设备的局部稳压电源
  • LED 驱动与小功率恒流/恒压充电器
  • 一般嵌入式系统和仪器仪表供电模块

六、典型设计要点与建议

  • 电感选择:建议选用额定电流高于 2A 的低直流电阻(DCR)电感,以降低损耗并保证稳态电流能力。
  • 输入/输出电容:输入侧需配置低 ESR 的电解或陶瓷电容以抑制瞬态电流和降低纹波;输出侧采用合适容量的低 ESR 电容以保证稳定性与低输出纹波。
  • 布局注意:高频开关节点(SW)走线尽量短且集中,输入电容靠近器件 VIN/GRND 布置,以减少环路面积并提升 EMI 性能。
  • 热管理:SOP-8 封装在高功率工作时需注意散热,合理铺铜与外延片接地有助于降低结温。
  • 启动/软启动与补偿:内部集成环路补偿简化外部设计,但在特殊负载或精密输出场景下仍需根据应用调整外部滤波器与补偿网络以优化瞬态响应与稳定性。

七、封装与型号说明

  • 型号:XL9004E1(XLSEMI / 芯龙)
  • 封装形式:SOP-8,便于常见 PCB 工艺流程组装与批量生产。

总结:XL9004E1 以其宽输入范围、高效率同步整流、内置补偿与多重保护特性,适合在汽车、工业与通信等需要稳定、紧凑电源解决方案的场合使用。合理选型外部被动元件与良好 PCB 布局能够充分发挥器件的性能优势。

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