WMSIC Electronic Components

XILINX XC6SLX16-2CSG225I XC6SLX16

ModelXC6SLX16-2CSG225I
Package225-CSPBGA(13x13)
BrandXILINX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

15 specifications

Core information

Product name
XILINX XC6SLX16-2CSG225I
Type
XILINX
Minimum package
160 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XILINX
Electronic Component
XC6SLX16-2CSG225I
Electronic Component
1
Package
225-CSPBGA(13x13)
Electronic Component
Programmable Logic Device (CPLD / FPGA)
Electronic Component
0.001g
Electronic Component
1
Electronic Component
BM0264916009
Operating Temperature
40℃~+100℃
Electronic Component
Electronic Component
Electronic Component
160

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XC6SLX16-2CSG225I FPGA产品概述

一、产品定位与系列背景

XC6SLX16-2CSG225I是Xilinx(赛灵思)Spartan-6系列的中端FPGA器件,主打低功耗、高性价比、工业级可靠性,针对中等复杂度数字系统设计,平衡性能与成本,广泛适配工业控制、通信接口、嵌入式终端等场景。Spartan-6系列采用45nm工艺,相比上一代Spartan-3E功耗降低50%以上,同时集成PCIe、DDR3等硬IP,减少外挂芯片需求,提升系统集成度。

二、核心硬件参数解析

2.1 逻辑与存储资源

  • 逻辑单元:由1139个CLB(可配置逻辑块)构成,总逻辑元件达14579个;每个CLB含2个Slice,每个Slice集成4个LUT(查找表)+8个触发器,支持组合逻辑与时序逻辑设计,满足中等复杂度数字电路需求(如协议解析、控制逻辑)。
  • 存储资源:总RAM位数589824(约72KB),包含两类存储:
    • 分布式RAM:由LUT配置,灵活适配小容量存储(如寄存器、小型查找表);
    • 块RAM:硬IP实现,速度更快、容量更大,可配置为单/双端口RAM、FIFO,满足数据缓存、高速数据传输需求,无需额外外挂RAM,降低BOM成本。

2.2 I/O资源

160个可编程I/O,支持LVCMOS、LVTTL、LVDS等多种电平标准;部分I/O支持高速差分传输(LVDS速率可达1Gbps以上),适配SPI、I2C、UART、Ethernet MAC等接口,可同时连接多通道外设(如传感器、通信模块)。

三、封装与供电特性

  • 封装:225-CSPBGA(13×13mm)表面贴装型,引脚密度高、体积紧凑,适合PCB空间受限的小型化设备(如便携式仪器、工业控制器模块);CSPBGA封装散热性能良好,避免高密度布线下的热积累问题。
  • 供电:核心电压范围1.14V~1.26V(典型1.2V),低电压设计降低功耗,同时支持宽电压范围,提升电源系统容错性,减少电压波动导致的系统不稳定。

四、工作环境与可靠性

  • 温度范围:结温(TJ)-40℃~100℃,符合工业级温度标准,可稳定工作于户外通信设备、工业自动化生产线、车载电子等 harsh 环境,避免高温下性能下降或器件损坏。
  • 可靠性:采用成熟45nm工艺,经过ESD防护、温度循环、湿度测试等严格可靠性验证,满足工业级器件的长期稳定运行要求,平均无故障时间(MTBF)达数十万小时。

五、典型应用场景

  1. 工业控制:PLC(可编程逻辑控制器)、伺服驱动器、传感器数据采集模块,利用160个I/O实现多通道信号采集与控制逻辑,低功耗适配无风扇设备。
  2. 通信接口:小型Ethernet交换机、USB2.0控制器、串口转以太网模块,集成高速I/O与存储资源,支持数据转发与协议处理。
  3. 嵌入式系统:物联网网关、手持智能终端,平衡性能与成本,实现本地数据处理与网络连接。
  4. 测试测量:示波器、信号发生器的信号处理模块,利用FPGA并行处理能力实现高速信号采集与分析。

六、产品优势总结

  • 性价比突出:成本远低于高端FPGA(如Virtex系列),满足中等复杂度需求的同时控制项目预算;
  • 低功耗设计:1.2V核心电压+45nm工艺,功耗比Spartan-3E降低50%,适合电池供电或散热受限场景;
  • 集成度高:内置块RAM、高速I/O,无需外挂存储/接口芯片,简化PCB设计,降低BOM成本;
  • 工业级可靠:-40℃~100℃结温范围,适配 harsh 工业环境,长期运行稳定性强。

XC6SLX16-2CSG225I凭借上述特性,成为工业、通信、嵌入式领域中等复杂度系统的理想选择,可快速实现从原型验证到量产的设计落地。

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