Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
XC6SLX45-2CSG324I是赛灵思(XILINX)Spartan-6 LX系列中的中等规模现场可编程门阵列(FPGA),针对成本敏感、功耗受限且需中等逻辑容量的应用场景优化设计,兼具性能与经济性,广泛适用于工业控制、消费电子、通信等领域。
Spartan-6系列是赛灵思45nm工艺FPGA的主力产品线之一,主打低功耗、低成本、高集成度,相比上一代Spartan-3系列,在相同容量下功耗降低约50%,逻辑密度提升显著。XC6SLX45作为该系列的核心型号,定位为“中等复杂度应用的最优解”——既满足工业控制、通信接入等场景的逻辑与存储需求,又避免高端FPGA的资源浪费与成本冗余。
XC6SLX45-2CSG324I的核心参数覆盖逻辑资源、存储资源、接口能力及环境适应性,具体如下:
类别 具体参数 逻辑资源 CLB数3411,逻辑元件总数43661 存储资源 总RAM位数2138112(含分布式RAM+块RAM) I/O接口 218个用户I/O,支持多标准差分/单端 供电特性 核心电压1.14V~1.26V,低功耗设计 环境适应性 工作结温范围-40°C~100°C,工业级可靠 封装规格 324引脚CSPBGA(15×15mm),表面贴装其中,逻辑元件可支持复杂组合逻辑与时序逻辑实现;总RAM容量满足数据缓存、小型队列或临时存储需求,无需额外外挂存储芯片;218个I/O可同时驱动多路传感器、通信接口及显示模块。
XC6SLX45-2CSG324I采用324引脚CSPBGA封装(15×15mm),是典型的紧凑型表面贴装封装,具有以下优势:
XC6SLX45-2CSG324I的参数特性决定了其在以下场景的广泛应用:
XC6SLX45-2CSG324I的核心价值体现在**“平衡”**二字:
综上,XC6SLX45-2CSG324I是一款高性价比、工业级可靠的中等规模FPGA,适合需要平衡成本、功耗与性能的各类嵌入式应用,是赛灵思Spartan-6系列的经典实用型号。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products