WMSIC Electronic Components

XILINX XC6SLX45-2CSG324I XC6SLX45

ModelXC6SLX45-2CSG324I
Package324-CSPBGA(15x15)
BrandXILINX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
XILINX XC6SLX45-2CSG324I
Type
XILINX
Unit
Electronic Component
Minimum package
126 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
XILINX
Electronic Component
XC6SLX45-2CSG324I
Electronic Component
1
Package
324-CSPBGA(15x15)
Electronic Component
Programmable Logic Device (CPLD / FPGA)
Electronic Component
60.6g
Electronic Component
1
Features
AES
Electronic Component
BM0265136094
Operating Temperature
40℃~+100℃
Electronic Component
Electronic Component
Electronic Component
126

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XC6SLX45-2CSG324I FPGA产品概述

XC6SLX45-2CSG324I是赛灵思(XILINX)Spartan-6 LX系列中的中等规模现场可编程门阵列(FPGA),针对成本敏感、功耗受限且需中等逻辑容量的应用场景优化设计,兼具性能与经济性,广泛适用于工业控制、消费电子、通信等领域。

一、产品定位与系列背景

Spartan-6系列是赛灵思45nm工艺FPGA的主力产品线之一,主打低功耗、低成本、高集成度,相比上一代Spartan-3系列,在相同容量下功耗降低约50%,逻辑密度提升显著。XC6SLX45作为该系列的核心型号,定位为“中等复杂度应用的最优解”——既满足工业控制、通信接入等场景的逻辑与存储需求,又避免高端FPGA的资源浪费与成本冗余。

二、核心性能参数

XC6SLX45-2CSG324I的核心参数覆盖逻辑资源、存储资源、接口能力及环境适应性,具体如下:

类别 具体参数 逻辑资源 CLB数3411,逻辑元件总数43661 存储资源 总RAM位数2138112(含分布式RAM+块RAM) I/O接口 218个用户I/O,支持多标准差分/单端 供电特性 核心电压1.14V~1.26V,低功耗设计 环境适应性 工作结温范围-40°C~100°C,工业级可靠 封装规格 324引脚CSPBGA(15×15mm),表面贴装

其中,逻辑元件可支持复杂组合逻辑与时序逻辑实现;总RAM容量满足数据缓存、小型队列或临时存储需求,无需额外外挂存储芯片;218个I/O可同时驱动多路传感器、通信接口及显示模块。

三、封装与接口特性

XC6SLX45-2CSG324I采用324引脚CSPBGA封装(15×15mm),是典型的紧凑型表面贴装封装,具有以下优势:

  1. 空间效率高:15×15mm的封装尺寸适合PCB布局紧凑的产品(如小型工业控制器、手持设备);
  2. I/O密度大:218个用户I/O分布在BGA焊盘上,支持LVCMOS、LVDS、SSTL等多种I/O标准,可兼容高速差分接口(如SPI、I2C、UART、以太网MAC);
  3. 散热良好:BGA封装的热传导路径优于QFP等封装,结合-40°C~100°C的宽温度范围,适合工业现场的高低温环境。

四、典型应用场景

XC6SLX45-2CSG324I的参数特性决定了其在以下场景的广泛应用:

  1. 工业自动化:PLC(可编程逻辑控制器)的逻辑控制单元、伺服驱动器的位置环算法实现、工业传感器数据采集与预处理;
  2. 通信接入设备:小型基站(pico基站)的基带处理辅助、光纤接入设备(ONU)的协议转换;
  3. 消费电子:高清机顶盒的视频解码辅助、智能电视的外设接口控制、车载显示控制器(辅助驾驶HUD的信号处理);
  4. 医疗设备:小型诊断仪器(如血糖仪、心电图仪)的数据处理与显示控制;
  5. 物联网网关:多协议(ZigBee、LoRa、Wi-Fi)的转换与数据聚合。

五、产品优势与价值

XC6SLX45-2CSG324I的核心价值体现在**“平衡”**二字:

  • 成本与性能平衡:中等逻辑容量满足大部分应用需求,避免高端FPGA的资源冗余,降低BOM成本;
  • 功耗与功能平衡:1.14V~1.26V的低核心电压,配合Spartan-6的动态功耗管理,适合电池供电或散热受限的设备;
  • 可靠性与空间平衡:工业级温度范围+紧凑型封装,兼顾恶劣环境适应性与产品小型化需求;
  • 开发效率平衡:赛灵思ISE设计工具支持,开发流程成熟,缩短产品上市周期。

综上,XC6SLX45-2CSG324I是一款高性价比、工业级可靠的中等规模FPGA,适合需要平衡成本、功耗与性能的各类嵌入式应用,是赛灵思Spartan-6系列的经典实用型号。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.