Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
XC7A100T-2FGG484I 是赛灵思(Xilinx)公司的 Artix-7 系列 FPGA(现场可编程门阵列)产品。该器件采用 484 引脚的 FCBGA(弹性球栅阵列)封装,设计上专注于低功耗、性能优越以及灵活的应用,广泛应用于嵌入式系统、无线通信、图像处理和工业控制等领域。
逻辑元件和单元: XC7A100T 配备 101440 个逻辑单元,具有高达 7925 个 LAB/CLB(逻辑阵列块/查找表),这种规模的逻辑资源使得 XC7A100T 能够支持复杂的逻辑计算和数据处理任务,适合大多数中等复杂度的应用需求。
内存资源: 该FPGA集成了 4976640 位的总 RAM,允许用户存储中间数据和参数,这在实时信号处理和数据流应用中极为重要。这种大容量的内存资源,为设计者提供了更大的灵活性,能够实现多种算法和数据结构的支持。
I/O 接口: XC7A100T 配备了 285 个 I/O 引脚,使得该器件能够方便地与其他组件和换能器进行连接。这种灵活的 I/O 配置支持多种通信协议(如 LVDS、LVCMOS等),可实现更高速度及更强兼容性的系统设计。
电压供电: XC7A100T 的工作电压范围为 0.95V ~ 1.05V,具有较低的功耗特性,适合对功耗有严格要求的应用场景,如便携式设备及高密度集成电路系统。
XC7A100T 的工作温度范围从 -40°C 到 100°C,使得该器件能够在极端和不利环境条件下运行,保证其在工业、汽车及其他严苛条件下应用的可靠性与稳定性。这一特性在设计高可靠性系统时尤为重要。
XC7A100T 以其丰富的资源和灵活性,广泛应用于多个领域,包括但不限于:
XC7A100T-2FGG484I 是一款集低功耗、高性能和丰富功能于一体的FPGA解决方案。其用于复杂应用的基本能力使其成为现代电子设计中不可或缺的工具。无论是在功能开发、原型测试还是最终产品部署中,该器件都展现出了其卓越的灵活性和可扩展性。
通过与赛灵思的丰富开发工具和生态系统结合,用户可以有效地简化设计流程,从而缩短产品上市时间。这一系列的特性使 XC7A100T-2FGG484I 成为当今电子工程师的理想选择,旨在满足不断变化的科技需求和市场挑战。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products