WMSIC Electronic Components

XILINX XC7A100T-2FGG484I XC7A100T

ModelXC7A100T-2FGG484I
PackageBGA-484
BrandXILINX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

16 specifications

Core information

Product name
XILINX XC7A100T-2FGG484I
Type
XILINX
Minimum package
60 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XILINX
Electronic Component
XC7A100T-2FGG484I
Electronic Component
1
Package
BGA-484
Electronic Component
Programmable Logic Device (CPLD / FPGA)
Electronic Component
2.25g
Electronic Component
1
Electronic Component
BM0084330085
Operating Temperature
40℃~+100℃
Logic
101440
Electronic Component
Electronic Component
Electronic Component
60

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:XC7A100T-2FGG484I

基本信息

XC7A100T-2FGG484I 是赛灵思(Xilinx)公司的 Artix-7 系列 FPGA(现场可编程门阵列)产品。该器件采用 484 引脚的 FCBGA(弹性球栅阵列)封装,设计上专注于低功耗、性能优越以及灵活的应用,广泛应用于嵌入式系统、无线通信、图像处理和工业控制等领域。

核心特性

  1. 逻辑元件和单元: XC7A100T 配备 101440 个逻辑单元,具有高达 7925 个 LAB/CLB(逻辑阵列块/查找表),这种规模的逻辑资源使得 XC7A100T 能够支持复杂的逻辑计算和数据处理任务,适合大多数中等复杂度的应用需求。

  2. 内存资源: 该FPGA集成了 4976640 位的总 RAM,允许用户存储中间数据和参数,这在实时信号处理和数据流应用中极为重要。这种大容量的内存资源,为设计者提供了更大的灵活性,能够实现多种算法和数据结构的支持。

  3. I/O 接口: XC7A100T 配备了 285 个 I/O 引脚,使得该器件能够方便地与其他组件和换能器进行连接。这种灵活的 I/O 配置支持多种通信协议(如 LVDS、LVCMOS等),可实现更高速度及更强兼容性的系统设计。

  4. 电压供电: XC7A100T 的工作电压范围为 0.95V ~ 1.05V,具有较低的功耗特性,适合对功耗有严格要求的应用场景,如便携式设备及高密度集成电路系统。

工作环境

XC7A100T 的工作温度范围从 -40°C 到 100°C,使得该器件能够在极端和不利环境条件下运行,保证其在工业、汽车及其他严苛条件下应用的可靠性与稳定性。这一特性在设计高可靠性系统时尤为重要。

应用领域

XC7A100T 以其丰富的资源和灵活性,广泛应用于多个领域,包括但不限于:

  • 通信基础设施:用于无线基站、光纤通信等高带宽低延迟的连接要求。
  • 工业自动化:FPGA的并行处理能力使其在实时控制系统中表现优异。
  • 图像处理:在图像传感器和视频解析设备中,XC7A100T 用于快速图像处理和信号解码。
  • 实验和原型开发:由于其灵活性和可重配置特性,非常适合快速原型设计和验证过程。

优势总结

XC7A100T-2FGG484I 是一款集低功耗、高性能和丰富功能于一体的FPGA解决方案。其用于复杂应用的基本能力使其成为现代电子设计中不可或缺的工具。无论是在功能开发、原型测试还是最终产品部署中,该器件都展现出了其卓越的灵活性和可扩展性。

通过与赛灵思的丰富开发工具和生态系统结合,用户可以有效地简化设计流程,从而缩短产品上市时间。这一系列的特性使 XC7A100T-2FGG484I 成为当今电子工程师的理想选择,旨在满足不断变化的科技需求和市场挑战。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.