WMSIC Electronic Components

XILINX XC6SLX45-3FGG484I XC6SLX45

ModelXC6SLX45-3FGG484I
Package484-FBGA(23x23)
BrandXILINX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 23+

Available for RFQ

Technical data

Product details

15 specifications

Core information

Product name
XILINX XC6SLX45-3FGG484I
Type
XILINX
Minimum package
60 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XILINX
Electronic Component
XC6SLX45-3FGG484I
Electronic Component
1
Package
484-FBGA(23x23)
Electronic Component
Programmable Logic Device (CPLD / FPGA)
Electronic Component
10.225g
Electronic Component
1
Electronic Component
BM0264916006
Operating Temperature
40℃~+100℃
Electronic Component
Electronic Component
Electronic Component
60

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XC6SLX45-3FGG484I 产品概述

一、概述

XC6SLX45-3FGG484I 是 XILINX(赛灵思)Spartan‑6 系列的中等规模 FPGA,封装为 484‑FBGA(23×23),提供高达 316 路用户 I/O,适用于工业级工作温度范围(-40°C ~ +100°C)。器件适合需要成本控制、低功耗且具备可编程逻辑与高速接口能力的嵌入式与工业应用。

二、关键特性

  • 中等密度逻辑资源,可实现复杂控制和信号处理功能;内置可综合的分布式 RAM 与块 RAM。
  • 支持多种 I/O 标准(LVCMOS、LVTTL、SSTL、HSTL、差分 LVDS 等),便于与模拟、存储器和高速串行器件接口。
  • 多个可编程 PLL/时钟管理资源,支持时钟域隔离与频率合成。
  • -3 速度等级,工业级温度等级(尾码 I),适合工业与汽车级环境(工作温度 -40~+100°C)。

三、主要参数(概要)

  • 器件型号:XC6SLX45-3FGG484I
  • 封装:484‑FBGA(23×23 mm)
  • 用户 I/O:316(依据封装引脚排列)
  • 工作温度:-40°C ~ +100°C(工业级)
  • 速度等级:-3(性能与时序需参考官方数据手册)

四、封装与布局建议

484‑FBGA 为高密度球栅阵列,PCB 设计时应注意电源平面、回流路径与热散布。建议采用:

  • 底部中心区设置热通孔(Thermal VIA)并连接散热/接地平面;
  • 全面去耦:在电源引脚附近放置不同电容值的旁路电容;
  • I/O 板级阻抗控制和差分线对匹配,避免串扰;
  • BGA 重新流焊工艺需按封装规范控制温度曲线以保证可靠性。

五、设计注意事项

  • 核心与 I/O 电压须严格按数据手册配合(核心电压与各 I/O BANK 电压、参考地)。
  • 时序收敛:对关键路径进行约束、使用时钟资源合理分配、考虑布线延迟与抖动。
  • 电源完整性:多点去耦与电源分层,防止瞬态掉电导致配置或运行错误。
  • 配置与编程:通过 JTAG 或 SelectMAP 等方式对器件进行配置,开发阶段使用 Xilinx ISE 工具链进行综合、布局与时序闭合。

六、典型应用

适用于工业控制、运动控制、串行/并行接口桥接、图像/视频前端处理、通信基带处理与嵌入式加速等场景。其工业温度等级和丰富 I/O 使其在严苛环境下具有较高适应性。

七、开发与支持

Xilinx 提供 ISE 设计套件、参考设计、IP 内核与器件数据手册。建议下载并参考官方器件规范(电气特性、时序参数与封装说明),并使用板级参考设计加速验证。

八、订购与型号说明

型号说明:XC6SLX45-3FGG484I 中 “-3” 表示速度等级,“FGG484” 表示 484‑FBGA 封装,“I” 表示工业温度等级。采购时留意批次与供应链可追溯性,并在量产前进行可靠性与环境测试验证。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.