Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
XCKU040-2FFVA1156I 是由 XILINX(赛灵思)公司推出的一款高性能FPGA(现场可编程门阵列),属于 Kintex UltraScale 系列。该系列产品结合了高密度的逻辑资源、高性能的时钟管理和极低的功耗,适用于多种高端应用领域。XCKU040-2FFVA1156I 的生产采用了先进的制程技术,使得其在功能和性能方面均有显著优势。
LAB/CLB 数量: 30300
逻辑元件/单元数: 530250
总 RAM 位数: 21606000
I/O 数量: 520
供电电压: 0.922V ~ 0.979V
安装类型: 表面贴装型
工作温度范围: -40°C ~ 100°C(TJ)
封装类型: 1156-BBGA,FCBGA
时钟管理组件: MMCM 和 PLL
高频性能: 725 MHz
XCKU040-2FFVA1156I FPGA广泛应用于以下领域:
数据中心与云计算: 适合用于智能网络、负载均衡和加速计算任务。
视频处理: 由于其高性能的逻辑处理能力和大并发的I/O,适合用于4K/8K视频编解码。
网络安全: 能够用作高速数据加密、解密和数据完整性检查的硬件加速器。
工业控制: 在极端温度和条件下的设备监控和控制,保障系统的可靠性和稳定性。
汽车电子: 在汽车传感器融合、自动驾驶算法和信息娱乐系统中担任核心角色,助力汽车智能化。
XCKU040-2FFVA1156I FPGA 代表了当今FPGA技术的发展趋势,其高度集成的逻辑单元、大容量的内存资源和卓越的性能表现,使其成为各种高端应用理想的解决方案。通过持续的创新和开发,XILINX 为设计工程师们提供了一个强大的平台,帮助其提升设计效率并实现更为复杂的功能。随着市场对灵活、高效计算需求的不断增长,XCKU040-2FFVA1156I 的市场前景值得期待。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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