WMSIC Electronic Components

XILINX XC7A50T-2FGG484I XC7A50T

ModelXC7A50T-2FGG484I
Package484-FBGA(23x23)
BrandXILINX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

17 specifications

Core information

Product name
XILINX XC7A50T-2FGG484I
Type
XILINX
Minimum package
60 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XILINX
Electronic Component
XC7A50T-2FGG484I
Electronic Component
1
Package
484-FBGA(23x23)
Electronic Component
Programmable Logic Device (CPLD / FPGA)
Electronic Component
26g
Electronic Component
1
Features
Integrated Temperature Sensor; SEU; AES
Electronic Component
BM0265429173
Operating Temperature
40℃~+100℃
Logic
52160
Electronic Component
Electronic Component
Electronic Component
60

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XC7A50T-2FGG484I FPGA产品概述

一、产品定位与系列归属

XC7A50T-2FGG484I是Xilinx(赛灵思)Artix-7系列中的工业级FPGA,核心定位为「平衡性能、功耗与成本」,同时满足工业环境下的宽温可靠性要求。Artix-7系列基于28nm HKMG(高k金属栅)工艺,是Xilinx低功耗FPGA产品线的主力型号——相比前代Spartan系列,其逻辑密度、DSP算力提升显著,同时保持了高性价比,适合工业控制、通信接入、测试测量等中高端场景。

二、核心硬件参数

该型号的硬件资源可支撑中等复杂度的数字系统设计,关键参数如下:

  • 逻辑资源:52160个可配置逻辑块(CLB),对应208640个查找表(LUT)和417280个寄存器,可实现复杂状态机、算法逻辑;
  • 存储资源:180个18Kb块RAM(BRAM),总容量3.24Mb,支持单端/差分读写,适配数据缓存、FIFO等场景;
  • DSP算力:120个DSP切片(25x18乘法器),定点运算速率达1.2G MACs/s,可满足PID控制、FFT等实时算法;
  • 时钟管理:4个时钟管理模块(CMT),含MMCM(混合模式时钟管理器)和PLL(锁相环),支持高精度分频/倍频、相位调整;
  • I/O资源:250个通用I/O引脚,兼容LVDS、LVCMOS、SSTL等电平标准,部分引脚可配置为高速差分接口。

三、封装与工作环境

  • 封装规格:484-FBGA(细间距球栅阵列)封装,尺寸23×23mm,引脚间距0.8mm,高密度布局适配PCB空间受限场景;
  • 工作温度:工业级宽温范围(-40℃~+100℃),后缀“I”明确其工业属性,可稳定工作于户外、车间等极端环境;
  • 可靠性设计:无铅工艺符合RoHS标准,引脚抗应力能力强,适配振动较大的工业场景。

四、典型应用场景

XC7A50T-2FGG484I的参数特性使其适用于以下核心场景:

  1. 工业控制:PLC(可编程逻辑控制器)、伺服驱动器、机器人关节控制器——宽温特性+DSP算力支撑实时控制;
  2. 通信接入:光纤ONU(光网络单元)、小基站基带单元——高速I/O+时钟管理满足数据传输稳定性;
  3. 测试测量:示波器、信号发生器、数据采集卡——丰富的存储资源实现数据缓存与处理;
  4. 消费电子:高清机顶盒、智能显示设备——低功耗特性适配家用散热要求。

五、关键技术特性

  1. 低功耗架构:28nm工艺使静态功耗降低50%+,动态功耗为同级别产品的70%,适合电池供电或散热受限设备;
  2. IP核生态:Vivado开发环境提供成熟IP(DDR3控制器、Ethernet MAC、PCIe Gen2等),缩短开发周期;
  3. 灵活配置:支持JTAG在线调试、SPI/BPI Flash离线配置,适配不同系统集成需求;
  4. 抗干扰能力:符合IEC 61000电磁兼容标准,抵抗工业现场电磁干扰,保证系统稳定。

六、选型与兼容性说明

  • 同系列升级/降级:逻辑不足可升XC7A75T(103040 CLB),成本敏感可选XC7A35T(34640 CLB),同封装(484FBGA)兼容;
  • 软件兼容:完全支持Xilinx Vivado Design Suite,与Artix-7、Zynq系列开发流程一致,降低学习成本;
  • 硬件兼容:484FBGA引脚布局与XC7A35T-2FGG484I等型号兼容,可实现硬件平台平滑升级。

该型号凭借「工业级可靠性+中高端性能+低功耗」的组合,成为工业、通信等领域中低复杂度数字系统的优选FPGA。

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