WMSIC Electronic Components

XTX XTP2401-12HASA0CT XTP2401

ModelXTP2401-12HASA0CT
PackageSOT-89-3
BrandXTX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XTX XTP2401-12HASA0CT
Type
XTX
Minimum package
500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
650mV@(150mA)
Electronic Component
XTX
Electronic Component
XTP2401-12HASA0CT
Electronic Component
1
Package
SOT-89-3
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.872g
Electronic Component
1
Electronic Component
BM0264754552
Operating Temperature
40℃~+85℃@(Ta)
Operating Voltage
40V
Output
Electronic Component
Output Voltage
12V
Output Current
150mA
Output Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XTP2401-12HASA0CT 产品概述

一、产品简介

XTP2401-12HASA0CT(品牌:XTX / 芯天下)是一款高输入压差、低静态电流的线性稳压器(LDO),输出极性为正极,固定输出电压12.0V,最大输出电流150mA。器件采用紧凑的SOT-89-3封装,兼容并可直接替代传统的78L12(在相同输出电压和小电流场景下),适用于对体积和功耗有要求的应用场合。

二、主要性能指标

  • 最大工作电压(输入):40V(器件允许的最高输入电压)
  • 输出电压:12.0V(固定)
  • 输出电流:最高150mA
  • 压差(Dropout):≈650mV @ 150mA(保证在满载时的最低差压)
  • 静态电流(Iq):典型值6µA(非常适合待机/低功耗系统)
  • 电源纹波抑制比(PSRR):45dB @ 1kHz(良好的噪声抑制能力)
  • 温度范围:-40℃ ~ +85℃(工作环境温度)
  • 保护特性:过流保护、短路保护、热关断(提高系统可靠性)
  • 输出通道:单通道,固定输出

三、优势对比与适用场景

相较于传统78L12,XTP2401-12在几个关键点具有明显优势:更低的压差(允许在更接近输出电压的输入条件下工作)、极低的静态电流显著降低待机损耗、更高的输入耐压(最高40V)及SOT-89小型封装便于在空间受限的电路板上使用。典型应用包括:工业控制供电、小型通信设备、仪表和传感器供电、车载电子(需注意汽车温度和瞬态要求)、便携式电源管理等。

四、使用建议与设计注意事项

  • 输入电压要求:为保证稳定输出,输入电压Vin应满足 Vin ≥ Vout + Dropout + 余量(建议Vin至少比12V高0.8~1.5V以覆盖瞬态)。
  • 输出电容:为保证环路稳定性和瞬态响应,建议在输出端并联Cout = 4.7µF ~ 22µF(优选X5R/X7R陶瓷或钽电解),注意避免超低ESR导致振荡;若使用陶瓷小电容,可并联少量电解/钽电容改善稳定性。
  • 输入电容:建议在Vin近端放置1µF~10µF的陶瓷电容作滤波与稳定。
  • 布局与散热:SOT-89虽为小封装但有一定热阻,板上应增加铜箔面积用于散热,注意热关断触发会影响持续输出能力。高功率损耗场合需评估结温与降额。
  • 保护与可靠性:器件内部集成过流与短路保护,但长期在极限工况(高Vin、高Iout)会带来较大功耗,建议在系统设计中留有余量并做好热设计。

五、封装与订购信息

  • 型号:XTP2401-12HASA0CT
  • 封装:SOT-89-3(小体积,便于自动贴装)
  • 主要特性:12V固定输出、150mA、40V输入耐压、6µA静态电流、内置过流/短路/热关断保护。

如需样片、器件详细脚位图或SPICE/热模型及推荐参考电路图,请联系芯天下(XTX)技术支持或查阅产品数据手册以获取全面的参数和应用建议。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.