Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
XHSC HC32F072FAUA-QN32TR HC32F072FAUA
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- XHSC HC32F072FAUA-QN32TR
- Type
- TQFN-32-EP(5X5)
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- XHSC
- Electronic Component
- HC32F072FAUA-QN32TR
- Electronic Component
- 1
- Package
- TQFN-32-EP(5x5)
- Electronic Component
- MCU(MCU / MPU / SOC)
- Electronic Component
- 0.207g
- CPU
- ARM Cortex-M0+
- I / O
- 25
- Electronic Component
- 1
- ADC
- 12bit
- DAC
- 12bit
- Electronic Component
- BM0257364757
- Operating Voltage
- 1.8V~5.5V
- CPU
- 48MHz
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
HC32F072FAUA-QN32TR 产品概述
HC32F072FAUA-QN32TR 是 XHSC（小华）推出的一款基于 ARM Cortex-M0+ 内核的低功耗通用单片机，适合对成本、功耗和功能有平衡要求的嵌入式应用。器件以小封装、高集成度和灵活的供电范围为特点，便于工业控制、传感采集和便携设备的快速开发与量产。
一、核心性能与存储
- CPU 内核：ARM Cortex-M0+，最高主频 48 MHz，兼顾计算能力与能效。
- 程序存储：128 KB FLASH，用于固件和代码存放，满足中等复杂度应用的软件需求。
- 工作内存：16 KB（描述中提供），用于运行时数据和堆栈，适合多数控制与信号处理任务。
二、外设与 I/O
- 通用 I/O 数量：25 路，可用于 GPIO、外部中断或复用为其他外设接口，适配多种外设连接需求。
- 模拟功能：内置 12-bit ADC 与 12-bit DAC，支持精度适中的模拟量采集与基准输出，方便传感器接口与模拟环路控制。
三、工作电压与功耗
- 工作电压范围：1.8 V 至 5.5 V，宽电压支持便于与不同系统电源兼容（如单节锂电、3.3 V 或 5 V 系统）。
- 低功耗特性：基于 Cortex-M0+ 内核，适合对待机和运行功耗敏感的应用场景（具体功耗数值请参考器件详细资料）。
四、封装与机械特性
- 封装类型：TQFN-32-EP（5 x 5 mm），热沉引脚（Exposed Pad）有利于散热与 PCB 牢固安装。
- 小尺寸封装便于空间受限的产品设计，同时保留较丰富的 I/O 和外设功能。
五、典型应用场景
- 传感器数据采集与预处理（使用 ADC + MCU 算法）
- 简易音频或控制输出（利用 12-bit DAC）
- 工业控制与人机界面的小型控制板
- 便携式电池供电设备与低功耗终端
六、开发与使用建议
- 推荐配套硬件平台用于评估 FLASH、SRAM 与外设性能，验证在 48 MHz 条件下的响应与实时性。
- 由于供电范围宽，请在系统设计中注意模拟子系统（ADC/DAC）参考地与电源滤波，避免噪声影响精度。
- 32 引脚 TQFN 封装在布局时需注意 Exposed Pad 的焊盘与散热处理，并做好地平面设计以改善 EMC 性能。
- 最终产品设计前请参照完整数据手册与器件引脚图，确认所有时序、电气与温度规范。
总结：HC32F072FAUA-QN32TR 以 Cortex-M0+ 性能、128 KB FLASH 与 12-bit ADC/DAC 的模拟能力，配合宽电压与小型 TQFN 封装，为中低端嵌入式应用提供了一款性价比较高的单片机选择。详细参数与时序信息建议以厂商正式数据手册为准。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
