Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
XHSC HC32L176MATA-LQFP80 HC32L176MATA
Configuration
1 options
Configuration
Option 199545
Availability on request
Technical data
Product details
18
specifications
Core information
- Product name
- XHSC HC32L176MATA-LQFP80
- Type
- LQFP-80(12X12)
- Minimum package
- 1190 托盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- XHSC
- Electronic Component
- HC32L176MATA-LQFP80
- Electronic Component
- 1
- Package
- LQFP-80(12x12)
- Electronic Component
- MCU(MCU / MPU / SOC)
- Electronic Component
- 0g
- CPU
- 32 Bit
- CPU
- ARM Cortex-M0+
- Electronic Component
- 1
- Electronic Component
- BM0230038947
- CPU
- 48MHz
- Electronic Component
- Electronic Component
- Electronic Component
- 1190
- Electronic Component
- 128KB
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
HC32L176MATA-LQFP80 产品概述
一、产品简介
HC32L176MATA-LQFP80 是 XHSC（小华）推出的一款基于 ARM Cortex‑M0 内核的 32 位微控制器。针对嵌入式控制与混合信号采集应用进行了优化，适合中小规模外围设备整合与实时控制场景。
二、核心性能
- CPU 内核：ARM Cortex‑M0，最高主频 48 MHz，执行效率适合大多数控制与信号处理任务；
- 程序存储：128 KB Flash，用于固件及参数存储；
- 工作电压：宽电压范围 1.8 V ~ 5.5 V，支持电池驱动与多电压系统兼容。
三、外设与模数能力
- I/O 数量：72 个通用 I/O，便于连接多路传感器与外设；
- ADC：12 bit 分辨率，满足常见精度的传感器采集和数据记录；
- DAC：12 bit 输出，可用于模拟控制量输出或基准信号生成。
具体外设（UART/SPI/I²C、定时器等）请参考完整数据手册以确认数量与复用方式。
四、封装与硬件设计要点
- 封装：LQFP‑80 (12×12 mm)，适合手工焊接与自动贴装；
- PCB 布局建议：靠近 VDD 引脚放置 0.1 µF 陶瓷去耦电容，模拟参考地与数字地合理分割，ADC/DAC 输入输出走短线并远离高频开关电流回路。
五、典型应用场景
适用于工业控制、传感器网关、智能仪表、家电控制和便携式测量设备等需要中等计算能力、丰富 I/O 与模数转换的场合。
六、评估与选型建议
在项目选型阶段，应结合外设需求、存储增长预留、功耗预算与工作电压环境核查外设支持情况；后续开发可使用兼容的调试/烧录工具与参考电路板快速验证功能。若需更高性能或更低功耗版本，可对比同系列其它型号。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
