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YAGEO CC0603JRNPO9BN100
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- YAGEO CC0603JRNPO9BN100
- Type
- YAGEO
- Unit
- Electronic Component
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- YAGEO
- Electronic Component
- CC0603JRNPO9BN100
- Electronic Component
- 1
- Electronic Component
- 10pF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.034g
- Electronic Component
- 1
- Electronic Component
- BM0000281632
- Electronic Component
- NP0
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：CC0603JRNPO9BN100（YAGEO）
基本信息
CC0603JRNPO9BN100是由知名电子元器件制造商YAGEO（国巨）生产的一款表面贴装陶瓷电容器，规格为0603（即1608公制），具有较小的尺寸和轻量的特性，适合各种现代电子设备。该电容器的基本参数包括：标称电容值为10pF，额定电压为50V，温度系数为C0G/NP0，容差为±5%。在广泛的应用环境下，CC0603JRNPO9BN100以其卓越的性能和可靠性赢得了众多设计工程师的青睐。
关键参数
- 精度与容值：该电容器的精度为±5%，标称容值为10pF，表明其在电路中能够提供稳定的电容值，有助于确保信号传输过程中的质量和稳定性。
- 额定电压：最大额定电压为50V，能够满足大多数消费电子和工业应用的需求，确保在正常工作条件下的安全性。
- 温漂系数：采用NP0（C0G）介质材料，该材料以其极低的温度系数和温差漂移而闻名，可有效保证电容值在不同温度下的稳定性。其工作温度范围从-55°C到125°C，使其适合于各种严苛的工作环境。
物理特性
- 封装尺寸：CC0603JRNPO9BN100的封装尺寸为0603，具体尺寸为1.60 mm x 0.80 mm x 0.90 mm（最大厚度）。这种小型化设计使得该电容器能够方便地集成到高密度电路板中，是现代电子产品设计的理想选择。
- 安装类型：采用表面贴装（SMD）类型，方便在自动化生产线上进行贴装，提升了生产效率并减少了装配过程中的人力成本。
应用领域
CC0603JRNPO9BN100广泛应用于各种电子设备，包括但不限于：
- 消费电子：如智能手机、平板电脑、笔记本电脑等，利用其稳定性来处理信号耦合与去耦。
- 通信设备：在通信设备中，电容器用于高频信号处理中，确保数据的可靠传输。
- 工业仪器设备：在工业应用中，电容器被用作滤波器和信号耦合组件，帮助提升设备的性能稳定性。
- 汽车电子：随着汽车电子化程度的提高，电容器在汽车控制系统和信息娱乐系统中的需求逐渐增加。
性能优势
- 高稳定性：因其低温漂系数，CC0603JRNPO9BN100电容器在极端温度下表现良好，适合对精度要求极高的应用场景。
- 空间节省设计：0603封装使其在空间受限的微型设备中表现出色，灵活应用于多种电路设计。
- 可靠性：长期使用寿命及优异的电气性能，降低了维修和更换的成本。
结论
综上所述，CC0603JRNPO9BN100是一款高性能、高可靠性的表面贴装陶瓷电容器，适用于各种电子应用场景。无论是在智能手机、计算机设备，还是在工业控制和汽车电子中，皆能发挥出色作用。其卓越的温度特性、稳定的电气性能和小巧的封装设计，使其成为设计工程师在现代电路设计中的理想选择。其广泛的适用性和可靠性也为电子产品的长久稳定运行提供了坚实保障。
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