Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
YAGEO CC0402KRX7R9BB104
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- YAGEO CC0402KRX7R9BB104
- Type
- YAGEO
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- YAGEO
- Electronic Component
- CC0402KRX7R9BB104
- Electronic Component
- 1
- Electronic Component
- 100nF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.014g
- Electronic Component
- 1
- Electronic Component
- BM0000280014
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：CC0402KRX7R9BB104 贴片电容
一、概述
CC0402KRX7R9BB104是国巨（YAGEO）公司推出的一款高性能贴片电容（MLCC），其规格参数令人满意，尤其适用于各种电子设备的广泛应用。这款电容以其稳定的温度特性和合理的额定电压，是电路设计师和工程师的理想选择，尤其是在对电容精度要求较高的场合。
二、基本参数
- 精度: ±10%
- 容值: 100nF（0.1µF）
- 额定电压: 50V
- 温漂系数: X7R
- 工作温度范围: -55°C ~ 125°C
- 安装类型: 表面贴装（SMD/SMT），适合现代小型化电路设计
- 封装规格: 0402（1005公制）
- 尺寸: 0.039" 长 x 0.020" 宽（1.00mm x 0.50mm）
- 厚度（最大值）: 0.022"（0.55mm）
该电容以其小巧的尺寸和较高的电压等级，完美地适应了当今多变的电子器件规格和工艺要求，能够有效支持现代电子设备向轻薄短小的趋势发展。
三、特性分析
温度系数:
- 采用X7R材料，表示电容在-55°C至125°C的工作温度范围内，呈现出优秀的稳定性和较小的温度变化对电容值的影响。X7R是介电常数相对较高的材料，适合需要电容量大且对温度敏感的应用。
容值与额定电压:
- 100nF的容值非常适合于多种应用场景，包括电源旁路和解耦电路等；而50V的额定电压也能够涵盖大部分工业、商业和消费类电子设备的需求，保障电路运行的稳定性。
封装与尺寸:
- 0402封装使得该电容在布局上具有很大的灵活性，适合用于智能手机、平板电脑、笔记本电脑等小型设备中，也方便在各种紧凑型电路板上进行组合和优化。
四、应用场景
CC0402KRX7R9BB104电容可广泛应用于以下领域：
- 消费电子: 如智能手机、平板电脑、可穿戴设备等小型电子产品的高频旁路和解耦。
- 工业设备: 电源管理和信号调理电路，确保电路的稳定运行。
- 通信设备: 用于与无线通信相关的设备中，改善信号质量和抗干扰能力。
- 汽车电子: 在汽车控制系统中，用于滤波和稳定电源，提高系统的安全性和可靠性。
五、总结
CC0402KRX7R9BB104贴片电容作为国巨公司的一款主力产品，凭借其优越的电气特性和可靠的性能表现，在现代电子领域中占有一席之地。它不仅支持多种高要求应用，还为设计师与工程师提供了良好的选择。其小尺寸设计和极具灵活性的安装方式，使其在日益紧凑的电子产品设计中展现出巨大的应用潜力。
随着全球电子产品向着更高的集成度和更小的尺寸发展，CC0402KRX7R9BB104电容也在不断适应各项需求，为客户提供了可靠的支持和保障。可以说，该电容是当前电子行业中一个可靠且经济的选择，值得广泛应用。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
