WMSIC Electronic Components

YAGEO CC0603KRX7R9BB473

ModelCC0603KRX7R9BB473
Package0603
BrandYAGEO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
YAGEO CC0603KRX7R9BB473
Type
YAGEO
Unit
Electronic Component
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
YAGEO
Electronic Component
CC0603KRX7R9BB473
Electronic Component
1
Electronic Component
47nF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.023g
Electronic Component
1
Electronic Component
BM0000280610
Electronic Component
X7R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:CC0603KRX7R9BB473 MLCC电容

1. 产品简介

CC0603KRX7R9BB473是由国巨(YAGEO)公司生产的一款表面贴装多层陶瓷电容器(MLCC)。该电容器具备出色的电性能和稳定的电气特性,广泛应用于多种电子产品中,适用于高频、高密度及小型化的电路设计。这款电容器的容值为47nF,额定电压为50V,采用了温度系数为X7R的介质材料,具有良好的温度稳定性和可靠性。

2. 主要参数

  • 容量值: 47nF(0.047µF)
  • 额定电压: 50V
  • 精度: ±10%
  • 容差: ±10%
  • 温度系数: X7R(-55°C ~ 125°C)
  • 工作温度范围: -55°C到125°C
  • 尺寸: 0603封装(长1.60mm x 宽0.80mm x 高0.90mm)
  • 封装类型: 表面贴装(SMD)

3. 温度特性

选用X7R介质材料,使得该电容器在广泛温度范围内保持相对稳定的电容量,适合在不同环境条件下长时间运行。X7R型电容的温度系数确保了在-55°C至125°C之间的工作温度下,电容值变化不大,通常保持在±15%的范围内。

4. 应用领域

CC0603KRX7R9BB473由于其良好的高频性能和小型封装,适合于多种电子设备的应用,包括:

  • 消费电子产品: 包括智能手机、平板电脑、笔记本电脑等。
  • 工业设备: 用于传感器、控制器和其他自动化设备中。
  • 汽车电子: 在汽车电子模块中的电子控制单元(ECU)以及传感器中实现高效能过滤。
  • 通信设备: 网络设备、路由器和基站等核心通信设备。
  • LED照明: 用于驱动电路及稳定电压等应用。

5. 设计优势

  • 小尺寸与高性能: 0603封装使其适合现代电子设备中对PCB空间的严格要求,能够被应用于高密度电路板上。
  • 高稳定性: X7R介质选择赋予了产品在温度变化时的可靠性,适合要求严格的应用。
  • 表面贴装设计: 便于自动化生产,提高生产效率,降低整体生产成本。

6. 总结

总的来说,CC0603KRX7R9BB473是一款性能稳定、尺寸紧凑且适用广泛的表面贴装多层陶瓷电容器,能够满足现代电子产品对空间、性能和耐用性的严格需求。其高额定电压和良好的工作温度范围使得它在各种高要求的应用场合里都能保持良好的工作性能,是电子设计师们理想的选择。选择国巨(YAGEO)的CC0603KRX7R9BB473电容,等于选择了一份高品质、高稳定性的承诺。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.