WMSIC Electronic Components

YAGEO CC0402JRNPO9BN390

ModelCC0402JRNPO9BN390
Package0402
BrandYAGEO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
YAGEO CC0402JRNPO9BN390
Type
YAGEO
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YAGEO
Electronic Component
CC0402JRNPO9BN390
Electronic Component
1
Electronic Component
39pF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±5%
Electronic Component
0.009g
Electronic Component
1
Electronic Component
BM0258857995
Electronic Component
NP0
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:CC0402JRNPO9BN390

CC0402JRNPO9BN390 是一款由国巨(YAGEO)生产的贴片电容器,属于多层陶瓷电容器(MLCC)系列。这款产品在电子电路设计中具有重要的应用价值,其小巧的尺寸和优异的性能使其广泛用于现代电子产品中。

1. 基本规格

  • 尺寸:CC0402JRNPO9BN390 的物理尺寸为 0.039" 长 x 0.020" 宽(1.00mm x 0.50mm),非常适合紧凑型电子设备的设计需求。其厚度最大为 0.022"(0.55mm),使得在空间受限的环境中具有良好的兼容性。
  • 电压等级:该电容器的额定电压为 50V,适用于中低压电流电路设计,为电路提供稳定的电容性能。
  • 电容值:其电容值为 39pF,适合用于滤波、耦合和去耦等多种应用场景。
  • 容差:电容器的容差为 ±5%,表示实际电容值与标称值之间的偏差不会超过这个范围,确保了电路设计的可靠性。
  • 工作温度范围:能够在 -55°C 至 125°C 的广泛温度范围内工作,适应各种极端环境,为其在汽车、工业和消费电子产品中的应用提供了保障。

2. 温度系数

CC0402JRNPO9BN390 采用 C0G(也称 NP0)材料,这是一种具有非常优良的温度稳定性的电介质材料。C0G 型电容器在电容值的变化上几乎不受温度影响,因此非常适合在对电容稳定性要求极高的电路中使用,如精密的模拟电路和高频电路。其电容值随温度变化的误差通常小于 ±30ppm/°C,从而确保长期稳定的性能。

3. 安装类型

此电容器为表面贴装(SMD)型,适合自动化贴片设备进行大规模生产。表面贴装技术(SMT)近年来得到广泛应用,其特点是省空间并提高生产效率,与传统的穿孔技术相比,可以进一步缩小印刷电路板(PCB)的尺寸。

4. 典型应用

CC0402JRNPO9BN390 适用于多种电子设备和电路设计中,包括:

  • 滤波电路:用于高频电路的旁路或去耦电容,抑制信号中的高频噪声,提升电路的稳定性和效率。
  • 耦合电路:在信号传输过程中利用电容器隔离直流成分,传送交流信号,确保信号完整地传输。
  • 谐振电路:该电容器也可用于频率选择性电路,确保信号跟随特定频率工作的谐振特性。
  • 消费电子产品:如手机、平板电脑、穿戴设备等,由于其小巧的体积和出色的性能,它还非常适合用于电视、音响等家用电器。

5. 总结

CC0402JRNPO9BN390 是一款性能优越、应用广泛的多层陶瓷贴片电容器,特别适合对电容尺寸、电压稳定性和温度承受能力有严格要求的现代电子产品。无论在消费电子、汽车电子,还是工业控制领域,CC0402JRNPO9BN390 都能提供可靠的电气性能与设计灵活性,帮助工程师们打造高性能电路设计。国巨凭借其在电子元器件领域的强大经验与技术背景,为客户提供可持续且高质量的产品解决方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.