WMSIC Electronic Components

YAGEO CC0402KRX7R9BB473

ModelCC0402KRX7R9BB473
Package0402
BrandYAGEO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
YAGEO CC0402KRX7R9BB473
Type
YAGEO
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YAGEO
Electronic Component
CC0402KRX7R9BB473
Electronic Component
1
Electronic Component
47nF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.009g
Electronic Component
1
Electronic Component
BM0086161694
Electronic Component
X7R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:CC0402KRX7R9BB473 电容器

CC0402KRX7R9BB473 是一款高性能的多层陶瓷电容器(MLCC),由知名电子元器件制造商 YAGEO(国巨)生产。这款电容器规格完备,适用于广泛的电子应用领域,尤其在高要求环境下表现出色。

基本参数

  1. 电容值:0.047µF(47nF)

    • 47nF 的电容值使其非常适合用于滤波、耦合和旁路等电路设计。
  2. 容差:±10%

    • 该容差等级提供了良好的性能一致性,使其能够满足精密电路的需求。
  3. 额定电压:50V

    • 50V 的额定工作电压确保了该电容器在多种工作条件下的稳健性,适用于多种低压至中压电子设备。
  4. 温度系数:X7R

    • X7R 表示该电容器在温度变化下具有较小的电容变化(±15%),使其在-55°C到125°C的宽温度范围内稳定工作,非常适合于高温和低温环境。
  5. 工作温度范围:-55°C ~ 125°C

    • 这使得该电容器能够在严酷环境中稳定工作,适用范围广泛。
  6. 安装类型:表面贴装(SMD),MLCC

    • 表面贴装设计使得安装更加简便,并且占用的板面积小,非常适合高密度布线的电路板。
  7. 封装/外壳:0402(1005 公制)

    • 小巧的0402 封装非常适合需要空间优化的电子设备,同时也符合现代电子设备对微型化的要求。
  8. 大小 / 尺寸:0.039" 长 x 0.020" 宽(1.00mm x 0.50mm)

    • 小尺寸设计进一步提高了电路的密集度,适应于现代紧凑型设备。
  9. 厚度:最大值 0.022"(0.55mm)

    • 适中的厚度使得该电容器可以与多层电路板的其他元件良好配合。

应用场景

CC0402KRX7R9BB473 电容器广泛应用于消费电子、工业设备、汽车电子、通信设备和医疗仪器等领域。其优秀的电气性能和宽广的温度范围使其成为各种电路中的理想选择,尤其是在以下应用中:

  • 滤波:在电源和信号电路中,有效降低噪声和干扰。
  • 耦合和解耦:用于高频信号的耦合,帮助信号无损传输,提升电路稳定性。
  • 旁路电容:通过有效滤除高频噪声,增强电源的稳定性,保护其他敏感元件的正常工作。

结论

在日益复杂和紧凑的电子设备设计中,CC0402KRX7R9BB473 以其优越的电性能和可靠的稳定性,成为设计者的重要选择。YAGEO(国巨)作为全球知名的电子元器件制造商,其产品以高质量著称,CC0402KRX7R9BB473 电容器的选择不仅可以满足多样化的应用需求,还能提升产品的整体性能和可靠性。无论是消费电子还是工业应用,这款电容器都展现出了卓越的价值,是现代电路设计不可或缺的基础元件。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.