Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
YAGEO CC0603KRX7R0BB103
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- YAGEO CC0603KRX7R0BB103
- Type
- YAGEO
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- YAGEO
- Electronic Component
- CC0603KRX7R0BB103
- Electronic Component
- 1
- Electronic Component
- 10nF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.023g
- Electronic Component
- 1
- Electronic Component
- BM0000001581
- Electronic Component
- X7R
- Voltage
- 100V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：CC0603KRX7R0BB103 贴片电容
基本信息
CC0603KRX7R0BB103 是由国巨（YAGEO）提供的一款高性能贴片电容（MLCC），具有良好的电气特性和广泛的应用范围，特别适用于高频和高压的电路设计。该电容的基本参数如下：
- 电容值：10nF（10000pF）
- 额定电压：100V
- 容差：±10%
- 工作温度范围：-55°C 至 125°C
- 厚度：最大值为0.035"（0.90mm）
- 安装类型：表面贴装（SMD）
- 温度系数：X7R
- 封装类型：0603
产品特性
高电压耐受性：CC0603KRX7R0BB103 的额定电压为100V，能够满足大多数现代电子设备的运行要求，确保在高电压环境下的稳定运行。
优良的温度特性：本款电容采用X7R温度系数，具备较好的温度依赖性变化特性，能够在-55°C到125°C的广泛温度范围内保持稳定的电容值，适合多种严苛环境条件下的应用。
小型化设计：0603封装格式使得该电容器尺寸小巧，便于在空间有限的电路板上进行布局，适合智能手机、平板电脑、可穿戴设备等小型电子产品。
良好的抗干扰性能：作为一种MLCC（多层陶瓷电容），CC0603KRX7R0BB103 具备良好的高频特性和低ESR（等效串联电阻），使其在信号滤波、去耦和旁路应用中表现出色，有效减少电源噪声和信号干扰。
可靠性强：国巨作为知名品牌，CC0603KRX7R0BB103 经过严格的品质控制和测试，确保产品在各类电子设备中的应用可靠并持久。
应用场景
因其独特的性能特征，CC0603KRX7R0BB103 可广泛应用于不同的领域，包括但不限于：
- 消费电子：手机、平板电脑、数码相机等设备中进行去耦、滤波等功能。
- 通信设备：路由器、交换机、基站等设备中的电源噪声抑制和信号耦合。
- 汽车电子：用于各种汽车电子控制单元（ECU）中，以确保电路在极端温度条件下的稳定性和安全性。
- 工业设备：适合于工业控制、传感器及监测系统中的稳定电源供给和信号处理。
总结
CC0603KRX7R0BB103 是一款高可靠性、高性能的贴片电容，凭借其小巧的尺寸和优异的电性能，已广泛应用于各种现代电子产品中，是推动电子技术进步不可或缺的元器件之一。无论是在家庭消费类电子产品还是在高端工业设备中，选择CC0603KRX7R0BB103都能为产品提供良好的电源管理与信号处理能力，是设计工程师们值得信赖的选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
