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CC0402JRX7R9BB103 是一款高性能的多层陶瓷电容器(MLCC),由知名电子元器件制造商 YAGEO(国巨)生产。该产品采用常见的0402(1005公制)封装,有效为现代电子设计提供紧凑而可靠的电容解决方案。该电容具备10nF(10000pF)的容量,额定电压50V,适合各类电子电路的广泛应用。
电容量:该电容的标称电容量为10nF(10000pF),适用于需要稳定电容值的电子电路,尤其在高频和高稳定性应用中表现优越。
容差:产品具有±5%的电容量容差,满足大多数应用需求,确保电容的实际性能在设计值的合理范围内。
额定电压:该电容的额定电压为50V,这意味着该产品在正常工作条件下可以承受最大50V的电压,非常适合于各种高压应用。
温度系数:选用X7R温度系数,该材料在-55°C至125°C的宽温度范围内表现良好,容量变化低于15%。X7R材料保证了在温度变化下电容器的良好稳定性,适用于医学、工业和消费类电子产品。
工作温度范围:-55°C至125°C的工作温度范围表明其适应性极好,可在极端环境条件下正常工作,使之非常适合高要求的应用场景。
表面贴装技术(SMD):CC0402JRX7R9BB103采用表面贴装技术,便于自动化生产,适用于现代高密度电路板设计,提供更好的占用空间利用率。
封装尺寸:0402标准封装设计(0.039"×0.020"或1.00mm×0.50mm),为紧凑型电路板设计提供了灵活的布局选择,广泛应用于各种小型设备中。
CC0402JRX7R9BB103多层陶瓷电容器是一种通用型电子元件,适用于多个领域及应用,包括但不限于:
消费电子:如智能手机、平板电脑、便携式音频设备等,需要小型化和高性能电容的产品。
汽车电子:在汽车控制器、传感器和信息娱乐系统中,为稳定电源和信号处理提供支持。
工业设备:如控制和自动化系统中,保证各种传感器和执行器间的信号稳定传输。
医疗设备:它的宽工作温度范围和可靠性使其在医疗监测和治疗设备中十分重要。
通信设备:用于信号滤波和耦合等高频信号处理场合,表现出色。
CC0402JRX7R9BB103是一款集高容量、高稳定性和紧凑型设计于一身的多层陶瓷电容器,广泛适用于从消费电子到工业、汽车及医疗设备的多种应用。凭借其出色的电气特性和耐用性,该产品在当今高密度、高性能电子产品中,提供了极为重要的支持。随着技术的不断进步,CC0402JRX7R9BB103将继续为现代电子产品的开发提供可靠的解决方案,助力各行各业的创新与发展。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
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Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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