Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CC0402KRX7R9BB222 是由YAGEO(国巨)生产的一种表面贴装陶瓷电容器,具有出色的性能和高度的可靠性。这款电容器采用0402(1005公制)封装,是一种广泛应用于各种电路设计中的多层陶瓷电容(MLCC)。其主要参数包括容量为2.2nF、额定电压为50V,以及温度系数为X7R。这种电容器尤其适用于紧凑型电子设备,体现了高性能与小体积的完美结合。
小型化设计:0402尺寸使得CC0402KRX7R9BB222极为适合现代电子产品,尤其是在空间受限的应用场景中。由于其小型化设计,该电容器能够有效减少电路板空间的占用,从而为其它元件释放出更多的安装位置。
高稳定性:X7R温度系数使电容在工作温度范围内表现十分稳定,适合于需要较高稳定性的应用,比如模拟信号处理、过滤和解耦等电路。
广泛应用性:CC0402KRX7R9BB222的通用特性使其可广泛应用于消费电子、通信设备、汽车电子及工业控制等各个领域,尤其是在对元件体积和性能都有较高要求的现代设计中。
消费电子产品:如智能手机、平板电脑和可穿戴设备等,因其小尺寸和高效能,适合用于信号耦合和过滤。
汽车电子:在汽车中的传感器模块、控制器和信息娱乐系统中得到了广泛的应用,确保了数据的稳定传输和控制精度。
通信设备:在射频(RF)电路、基站、调制解调器等应用中,能够实现信号的精确处理和干扰抑制。
工业控制:在各种工业智能控制系统中,用于去耦合和滤波,有助于提高电路的抗干扰能力和稳定性。
CC0402KRX7R9BB222是一款高性能、多功能的表面贴装陶瓷电容器,凭借其小巧的0402封装和卓越的电气性能,成为现代电子产品设计中不可或缺的元件。YAGEO(国巨)作为全球知名的电子元件制造商,其产品在可靠性和质量上都保障了用户的设计需求。无论是在消费电子还是工业应用中,CC0402KRX7R9BB222都能有效满足电路设计师对空间与性能的双重要求。选择YAGEO的这款电容器,将为您的项目增添无穷的可能性与价值。
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Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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