WMSIC Electronic Components

YAGEO CC0402JRNPO9BN101

ModelCC0402JRNPO9BN101
Package0402
BrandYAGEO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
YAGEO CC0402JRNPO9BN101
Type
0402
Unit
Electronic Component
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
YAGEO
Electronic Component
CC0402JRNPO9BN101
Electronic Component
1
Electronic Component
100pF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±5%
Electronic Component
0.009g
Electronic Component
1
Electronic Component
BM0000280607
Electronic Component
NP0
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:CC0402JRNPO9BN101 贴片电容

产品简介

CC0402JRNPO9BN101是由知名电子元器件制造商YAGEO(国巨)出品的一款高性能贴片电容,采用多层陶瓷电容器(MLCC)技术,具有优异的电气特性和热稳定性。其主要参数包括容量100pF、额定电压50V、温度系数C0G(NP0)以及封装尺寸0402(1005公制),是一款广泛应用于各种电子设备中的通用电容器。

产品参数与特性

  • 容量及精度:该电容器的容值为100pF,同时其容差为±5%,保证了电路中的精准应用。该容值在高频电路和信号耦合应用中表现优异,能够有效抑制噪声,平滑信号波形。

  • 额定电压:额定电压为50V,展现出良好的电气绝缘性能,能够支持高电压环境下的稳定工作,确保在高压电场中不会发生击穿现象,适用于对电压有较高要求的应用场合。

  • 温度特性:电容的温度系数为C0G(NP0),这表明在-55°C至125°C的广泛工作温度范围内,该电容表现出极低的温度漂移特性。同时,C0G特性使其在不同温度下保持较高的稳定性,适合在严苛环境下的电子设备使用。

  • 封装及尺寸:产品采用0402(1005公制)的封装形式,尺寸为1.00mm x 0.50mm,厚度最大为0.55mm。这种小型化设计让它在空间有限的应用设计中尤为重要,适合现代电子产品对紧凑性和集成度的日益增长的需求。

应用领域

CC0402JRNPO9BN101贴片电容适用于多种电子电路,包括但不限于:

  1. 信号耦合与解耦:广泛应用于高频信号处理和电源解耦,能够帮助滤除不必要的噪声,确保信号的纯净度。

  2. 高频电路:由于其小型化和高稳定性的特性,适合用于高频RF电路、射频应用、移动通信和基站设备等领域。

  3. 消费电子:可在各种消费电子产品中找到,如智能手机、平板电脑、电视机、音响设备等,尤其是在音频和视频信号处理方面。

  4. 工业电子:在工业控制设备、测量仪器和医疗设备中,借助其高稳定性和可靠性,能够确保系统在长期运行中的一致性和安全性。

总结

CC0402JRNPO9BN101贴片电容是YAGEO提供的一款高性能MLCC,其稳定的电气特性、优良的温度特性和多种应用适应性,使其在现代电子设计中保持着重要的地位。以其小巧的封装、较高的额定电压及精确的容值,适合于高频率及高要求的电子产品,能够为设计师提供灵活的设计选择,确保电子产品的整体性能和可靠性。这款电容是实现更高集成度和小型化电子设备的理想选择,是电子工程师必不可少的组件之一。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.