WMSIC Electronic Components

YAGEO CC0201KRX5R5BB104

ModelCC0201KRX5R5BB104
Package0201
BrandYAGEO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
YAGEO CC0201KRX5R5BB104
Type
YAGEO
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YAGEO
Electronic Component
CC0201KRX5R5BB104
Electronic Component
1
Electronic Component
100nF
Package
0201
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.008g
Electronic Component
1
Electronic Component
BM0257676725
Electronic Component
X5R
Voltage
6.3V
Electronic Component
Electronic Component
Electronic Component
15000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CC0201KRX5R5BB104 产品概述

概要

CC0201KRX5R5BB104 是由知名电子元器件制造商 YAGEO(国巨)生产的一款多层陶瓷电容器(MLCC),属于表面贴装(SMD)类型。以下是对此产品的详细介绍。

基础参数

  • 电容值: 0.1 µF (100 nF)
  • 容差: ±10%
  • 额定电压: 6.3 V
  • 温度系数: X5R
  • 工作温度范围: -55°C ~ 85°C
  • 应用场景: 通用应用

封装和尺寸

  • 封装类型: 0201(0603 公制)
  • 大小/尺寸: 0.024" 长 x 0.012" 宽(0.60 mm x 0.30 mm)
  • 厚度(最大值): 0.013"(0.33 mm)

描述

CC0201KRX5R5BB104 是一款小型化的多层陶瓷电容器,适用于各种电子设备中的通用应用。其采用0201封装,这使得它非常适合用于空间有限但要求高性能的现代电子产品中。

特性和优势

温度稳定性

此电容器具有X5R温度系数,这意味着在-55°C到85°C的温度范围内,其电容值变化不会超过±15%。这种稳定性使其在各种环境条件下都能保持良好的性能。

容差

±10%的容差保证了电容器在实际应用中的可靠性和一致性,满足大多数通用应用的需求。

高可靠性

YAGEO作为一家知名的电子元器件制造商,严格控制生产过程,确保每个产品都经过严格的测试和验证,从而提供高可靠性的产品。

小型化设计

0201封装使得CC0201KRX5R5BB104非常适合用于紧凑的 PCB 设计,特别是在移动设备、汽车电子、工业控制等领域。

应用场景

移动设备

在智能手机、平板电脑等移动设备中,CC0201KRX5R5BB104 可以用于滤波、耦合和旁路等应用,帮助优化信号质量和降低噪音。

汽车电子

由于其良好的温度稳定性和高可靠性,这款电容器也广泛应用于汽车电子系统,如娱乐系统、导航系统和安全控制系统。

工业控制

在工业控制领域,CC0201KRX5R5BB104 可用于各种控制板和模块中,例如机器人控制、工厂自动化等场景。

安装和使用注意事项

表面贴装

作为一款SMD产品,CC0201KRX5R5BB104 需要通过再流焊或其他适当的表面贴装技术进行安装。确保在安装过程中遵循适当的焊接参数,以避免损坏元件。

电压和温度限制

在使用中,请确保不超过额定电压(6.3V)和工作温度范围(-55°C ~ 85°C),以防止元件损坏或性能下降。

总结

CC0201KRX5R5BB104 是一款高性能、紧凑设计的多层陶瓷电容器,适用于广泛的通用应用。其优异的温度稳定性、精确的容差以及小型化设计,使其成为现代电子产品设计中的理想选择。通过选择 YAGEO 的此款产品,您可以确保您的电子设备具有高可靠性和稳定性能。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.