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YAGEO CC0603KRX7R9BB682
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- YAGEO CC0603KRX7R9BB682
- Type
- YAGEO
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- YAGEO
- Electronic Component
- CC0603KRX7R9BB682
- Electronic Component
- 1
- Electronic Component
- 6.8nF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.023g
- Electronic Component
- 1
- Electronic Component
- BM0004084547
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CC0603KRX7R9BB682 产品概述
一、产品概述
CC0603KRX7R9BB682 是 YAGEO（国巨）系列贴片多层陶瓷电容（MLCC），尺寸为 0603（1.6 × 0.8 mm），额定电压 50 V，标称电容 6.8 nF（6800 pF），容差 ±10%（K），介质类别 X7R。该产品面向对体积、可靠性和成本有综合要求的一般滤波、去耦与耦合场合。
二、主要规格与特性
- 容值：6.8 nF（6800 pF）
- 容差：±10%（K）
- 额定电压：50 V DC
- 介质温度系数：X7R（-55°C ～ +125°C，典型温漂在该温度范围内保持在可接受范围内）
- 封装：0603（符合常见 SMT 贴装工艺）
- 品牌：YAGEO（国巨）
三、典型电气与温度行为
X7R 属于温度特性稳健的介质，但仍属于“电容随温度与直流偏压会变化”的类别。在高直流偏压或靠近额定电压长期工作时，电容值可能出现明显下降；低频下的等效串联电阻（ESR）较低，适合一般去耦与旁路应用。具体的频率特性与 DC-bias 曲线请参考厂商数据手册。
四、封装与可加工性
0603 小封装适合高密度贴片设计，兼容自动贴装与回流焊工艺。建议按 J-STD-020 标准控制回流焊温度曲线（峰值可达 245–260°C，需依据焊膏与工艺确认）。贴装时注意避免过度机械弯曲或应力集中，以防裂芯或失效。
五、典型应用场景
- 电源轨去耦与旁路
- 模拟前端滤波与阻抗匹配
- 高频信号旁路、耦合与噪声抑制
- 工业控制、消费电子与通信设备中通用旁路元件
六、设计与使用建议
为保证长期性能，应考虑 DC-bias 导致的电容衰减并适当留裕量；在关键滤波电路或时间常数设计中，建议对在工作电压下的实际电容值进行测量或采用厂商提供的 DC-bias 数据。贴装时避免在基板上施加局部应力，回流后如需二次加工应遵循厂商工艺规范。
七、可靠性与储存
本系列 MLCC 具有良好的温湿循环与机械可靠性。储存时避免潮湿、高温与强酸碱环境，贴片卷带应在开卷后按照湿敏等级（MSL）要求在规定时间内回流焊接，未按要求处理可能导致焊接缺陷或可靠性下降。
如需更详细的频率响应、DC-bias 特性图或可靠性试验数据，请参阅 YAGEO 官方数据手册或联系供应商获取支持。
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