Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
YAGEO CC0402JRNPO9BN680
Configuration
1 options
Configuration
Electronic Component
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- YAGEO CC0402JRNPO9BN680
- Type
- YAGEO
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- YAGEO
- Electronic Component
- CC0402JRNPO9BN680
- Electronic Component
- 1
- Electronic Component
- 68pF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.009g
- Electronic Component
- 1
- Electronic Component
- BM0264752011
- Electronic Component
- NP0
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：CC0402JRNPO9BN680 贴片电容
产品名称：CC0402JRNPO9BN680
类型：多层陶瓷电容器 (MLCC)
应用场景： CC0402JRNPO9BN680 是一款高性能的表面贴装多层陶瓷电容器，广泛应用于通信、消费电子、汽车电子、工业控制、医疗设备等多个领域。这款电容器凭借其稳定的电气特性和优异的温度性能，适用于高频信号处理、电源滤波、去耦和耦合等功能。
技术规格：
- 电容量：68pF
- 容差：±5%
- 额定电压：50V
- 温度系数：C0G（NP0）
- 工作温度范围：-55°C ~ 125°C
- 安装类型：表面贴装 (SMD)
- 封装尺寸：0402（1005 公制）
- 尺寸：长0.039" x 宽0.020"（1.00mm x 0.50mm）
- 厚度（最大值）：0.022"（0.55mm）
- 品牌：YAGEO（国巨）
电性能特性：
- 稳定性：使用 C0G (NP0) 材料，CC0402JRNPO9BN680 提供出色的电容稳定性，具有良好的温度和频率特性，适合要求严格的应用。
- 高额定电压：该产品的额定电压为50V，能够承受较高的电压波动，有效降低了电容击穿风险。
- 高温工作能力：具备宽广的工作温度范围，确保其在-55°C到125°C的极端环境下正常工作，使其适合各种气候条件和应用场景。
安装优势： 以0402封装的形状使得CC0402JRNPO9BN680在电路板上的占用空间非常小，同时便于自动化贴片生产。其小型化设计使得该电容器特别适用于追求紧凑和高密度电路板设计的领域，如智能手机、平板电脑及其他消费电子产品。
可靠性与寿命： 国巨作为全球领先的电子元件制造商，其产品在严格的质量控制下生产，确保其在极端环境中也能维持高可靠性。CC0402JRNPO9BN680 的长寿命特性使得其在重要的电子设备中得到了广泛应用，减少了维护成本和调试难度。
应用实例：
- 高频电路：其68pF的电容量和超低失真特性使得该电容器非常适合无线通信和射频电路。
- 信号处理：在信号处理链路中作为去耦元件，可以有效抑制高频噪声，增强电路稳定性。
- 功率管理：适用于电源滤波，能够提高电源的稳定性，并减少电磁干扰(EMI)。
总结： 作为一款高品质且应用广泛的表面贴装陶瓷电容器，CC0402JRNPO9BN680不仅具有出色的电气特性和稳定性，而且其小巧的封装设计进一步满足了现代电子产品对小型化和高性能的需求。无论是在消费电子、工业设备还是汽车电子领域，该电容器都能提供可靠的性能表现，是设计人员理想的选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
