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YAGEO RC0201FR-0733RL Resistor RC0201FR
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- YAGEO RC0201FR-0733RL
- Type
- YAGEO
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 50mW
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- YAGEO
- Electronic Component
- RC0201FR-0733RL
- Electronic Component
- 1
- Package
- 0201
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.008g
- Electronic Component
- 33Ω
- Electronic Component
- 1
- Electronic Component
- BM0233355786
- Operating Temperature
- 55℃~+125℃
- Operating Voltage
- 25V
- Electronic Component
- ±200ppm/℃
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RC0201FR-0733RL 产品概述
一、产品简介
RC0201FR-0733RL 为国巨（YAGEO）系列厚膜贴片电阻，阻值 33 Ω，精度 ±1%，额定功率 1/20W（50 mW），额定工作电压 25 V，温度系数典型 ±200 ppm/℃，工作温度范围 -55℃ 到 +125℃。封装为 0201（约 0.6 mm × 0.3 mm），适合高密度、超小型化电路板设计。
二、主要性能与规格
- 电阻类型：厚膜电阻（厚膜工艺，稳定性好、成本低）
- 标称阻值：33 Ω
- 精度：±1%（1/100）
- 额定功率：0.05 W（50 mW）
- 最大工作电压：25 V
- 温度系数（TCR）：±200 ppm/℃（中等温漂，适合多数泛用电阻应用）
- 工作温度：-55℃ ～ +125℃
- 封装：0201（超小型 SMD）
三、结构与封装特点
0201 超小封装可在极高组装密度下节省 PCB 面积，适用于手机、可穿戴设备、蓝牙耳机等尺寸受限的电子产品。厚膜电阻具有良好的可焊性和批量一致性，但由于体积小，热容量低，应重视热管理与功率限制。
四、典型应用场景
- 移动终端与可穿戴设备中的限流、分压、偏置电阻
- 高频模块与射频电路中的阻抗配合（需注意寄生因素）
- 精密模拟电路中作为定值电阻或阻抗匹配组件（±1% 精度满足多数精度需求）
- 工业控制与消费电子的信号处理、滤波、检测电路
五、使用建议与可靠性注意事项
- 功率与热降额：0201 包装功率仅 50 mW，工作时应留有裕量，避免长期满载；遵循制造商的降额曲线以延长寿命。
- 温度影响：±200 ppm/℃ 的 TCR 对于温度敏感应用（如精密测量）可能需额外补偿或选用低 TCR 型号。
- 焊接工艺：兼容常规回流焊，建议按照回流曲线控制峰值温度与时间，避免反复高温循环导致性能退化。
- 布线与布局：尽量缩短与电阻相连的走线以减少寄生阻抗与噪声耦合；高功率或热源附近应适当留距或使用散热手段。
- 测试与测量：批量测试可用标准阻值测试仪或 LCR 表；在电路中测量时注意并联/串联元件对读数的影响。
- 储存与防潮：遵循常规贴片元件防潮、避免长时间暴露于高湿环境，出库后按先入先出原则使用。
六、选型建议
若电路对温漂或长期稳定性要求更高，可考虑薄膜或低 TCR 产品；若需要更高功率，应选择更大封装（0402、0603 等）或多颗并联分担热量。封装尺寸与可焊性、贴装精度需与 SMT 产线能力匹配。
小结：RC0201FR-0733RL 以其超小封装与 ±1% 精度，适合追求体积与精度平衡的高密度应用场景，但在热管理与功率限制方面需要设计时给予足够重视，以确保长期可靠性。
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