WMSIC Electronic Components

YAGEO RC0201FR-072K7L Resistor RC0201FR

ModelRC0201FR-072K7L
Package0201
BrandYAGEO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YAGEO RC0201FR-072K7L
Type
YAGEO
Minimum package
10000 圆盘

Technical parameters

Power
50mW
Electronic Component
Electronic Component
Electronic Component
YAGEO
Electronic Component
RC0201FR-072K7L
Electronic Component
1
Package
0201
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.008g
Electronic Component
2.7kΩ
Electronic Component
10
Electronic Component
BM0262576584
Operating Temperature
55℃~+125℃
Operating Voltage
25V
Electronic Component
±200ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RC0201FR-072K7L 产品概述

一、产品简介

RC0201FR-072K7L 为 YAGEO(国巨)品牌的 0201 封装贴片厚膜固定电阻,阻值 2.7kΩ,精度 ±1%,额定功率 50mW,温度系数(TCR)±200ppm/℃。工作温度范围为 -55℃ 至 +125℃,额定工作电压 25V。该型号以超小体积和良好的通用电气特性适用于体积受限和高密度布线的电子产品。

二、主要参数(一目了然)

  • 阻值:2.7kΩ
  • 精度:±1%
  • 功率:50mW(额定)
  • 封装:0201(超小型 SMD)
  • 电阻类型:厚膜电阻
  • 温度系数:±200ppm/℃
  • 工作温度:-55℃ ~ +125℃
  • 额定工作电压:25V

三、产品特点与优势

  • 超小封装(0201)适合高密度贴装和小型化设计,节省 PCB 面积。
  • ±1% 精度满足多数模拟与数字电路对精密阻值的要求。
  • ±200ppm/℃ 的温漂在厚膜器件中处于常见水平,可用于一般商用环境。
  • 厚膜工艺成本与量产稳定性良好,适用于中低至中等精度场合。
  • 宽工作温度范围和较低功耗特性使其可用于工业级和消费电子类产品。

四、使用建议与注意事项

  • 功率与散热:标称功率 50mW 为理想散热条件下额定值,实际应用中应考虑 PCB 热阻与周围器件影响,必要时进行功率降额设计(建议在高温或密集布线场景下留有 20%~50% 余量)。
  • 温度影响:在高温环境下阻值会随 TCR 变化,关键电路建议在电路设计中预留温度误差预算。
  • 焊接工艺:支持常规无铅回流焊,建议按 PCB 制程控制峰值温度(≤260℃)与温度-时间曲线,以避免元件应力或焊接缺陷。
  • 贴装注意:0201 为超微小封装,对贴装设备精度和锡膏印刷精细度要求较高,注意防止飞线、偏位或丢件。
  • 清洗与可靠性:推荐使用温和溶剂(如异丙醇)清洗,避免强腐蚀性化学品。存储与运输注意防潮防静电。

五、典型应用

  • 手机、可穿戴设备等高度集成的便携式电子设备中的分压、电阻矩阵与偏置网络。
  • 精密模拟电路、滤波与放大器中对阻值稳定性有一定要求的场合(在允许的温漂范围内)。
  • 工业控制、传感器接口与信号调理电路,特别是对体积要求严格的多通道设计。

六、选型与采购建议

  • 若对温漂和噪声有更高要求,可考虑薄膜或金属膜低 TCR 精密电阻;若需要更高功率或更低精度,可选择更大封装或不同系列产品。
  • 在进行 BOM 管理时,注意与供应商确认封装外观、带卷包装规格及可追溯批号,以便量产一致性与质量控制。

该型号提供了在微型化设计中兼顾精度与成本的解决方案,适合要求 PCB 空间受限且需稳定电阻值的多种通用电子应用。

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