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YAGEO RC0201FR-075K1L Resistor RC0201FR
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- YAGEO RC0201FR-075K1L
- Type
- YAGEO
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 50mW
- Electronic Component
- Electronic Component
- Electronic Component
- YAGEO
- Electronic Component
- RC0201FR-075K1L
- Electronic Component
- 1
- Package
- 0201
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.008g
- Electronic Component
- 5.1kΩ
- Electronic Component
- 1
- Electronic Component
- BM0257217751
- Operating Temperature
- 55℃~+125℃
- Operating Voltage
- 25V
- Electronic Component
- ±200ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RC0201FR-075K1L 产品概述
一、概述
RC0201FR-075K1L 为国巨（YAGEO）系列片式厚膜电阻，封装规格为 0201，阻值 5.1kΩ，精度 ±1%，额定功率 50mW，工作电压 25V，温度系数 ±200ppm/℃，工作温度范围 -55℃ 至 +125℃。该系列以微型化、高可靠性及良好批量可贴装性为特点，适合空间受限且对精度有中高要求的消费电子、通信和便携设备。
二、主要参数
- 电阻类型：厚膜电阻
- 阻值：5.1kΩ
- 精度：±1%
- 额定功率：50mW（在环境温度下）
- 最大工作电压：25V
- 温度系数（TCR）：±200ppm/℃
- 工作温度：-55℃ ～ +125℃
- 封装：0201（约 0.6mm × 0.3mm，厚度约 0.2mm，具体见厂方尺寸表）
三、特性与优势
- 微型化封装（0201）有助于高密度 PCB 设计与小型化产品实现。
- ±1% 精度满足多数模拟电路与分压、偏置等场景的稳定性要求。
- 厚膜制造工艺成本优势明显，适合大批量生产。
- 良好的温度系数与宽工作温度带保证在工业级和消费类环境下的稳定性。
- 兼容主流 SMT 贴装与回流焊工艺，适合自动化装配线。
四、典型应用
- 手机、平板、可穿戴设备的信号与分压网络；
- 通信设备与射频前端的偏置与阻抗匹配（在功率允许范围内）；
- 传感器接口、ADC/DAC 前端电路的取样与限流；
- 工业控制和物联网终端的常规电阻需求。
五、装配与使用注意
- 功率与电压限制：单片额定功率 50mW，工作电压限 25V，实际使用时请考虑环境温度与散热，必要时按厂方建议做功率降额。
- 回流焊：推荐遵循厂方回流曲线（无铅回流峰值温度通常 ≤260℃），避免过长高温暴露导致电阻值漂移或焊盘失粘。
- 贴装取放：0201 为超小封装，需采用适配吸嘴与高精度贴装机，同时注意元件丢失/飞散风险。
- 清洗与化学品：避免使用强腐蚀性溶剂清洗，可能影响外覆保护层与长期可靠性。
六、可靠性与质量
国巨产品线通常通过包括温度循环、湿热、机械冲击与焊接耐受性等可靠性验证，适合消费电子至工业级应用。对长期漂移有控制，但在关键应用（如高精度参考电阻）建议选用更低 TCR 或金属膜/薄膜电阻器。
七、包装与订购
此类产品一般以卷带（tape & reel）形式提供，便于 SMT 自动化贴装。订购时请确认完整料号与批次，必要时向供应商索取详细数据表、尺寸图与回流焊建议以满足生产与可靠性要求。
如需数据表（Datasheet）、尺寸图或回流曲线图，我可以帮您整理并指出关键测试条件与装配建议。
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