Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
YAGEO RC0603FR-0720KL Resistor RC0603FR
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- YAGEO RC0603FR-0720KL
- Type
- YAGEO
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 100mW
- Electronic Component
- Electronic Component
- Electronic Component
- YAGEO
- Electronic Component
- RC0603FR-0720KL
- Electronic Component
- 1
- Package
- 0603
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.023g
- Electronic Component
- 20kΩ
- Electronic Component
- 1
- Electronic Component
- BM69414694
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 75V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：RC0603FR-0720KL 贴片电阻
概述
RC0603FR-0720KL 是由 Yageo（国巨）制造的一款高性能贴片电阻，属于其 RC 系列。该电阻特有的 0603（1608 公制）封装，适合用于各种现代电子设备，尤其是在空间受限的应用中。这款贴片电阻以其卓越的性能、可靠的稳定性和多样的应用场景，成为设计工程师和电子爱好者的重要选择。
基础参数
- 电阻值：20 kΩ
- 功率额定值：100 mW（即 1/10 W）
- 容差：±1%
- 温度系数：±100 ppm/°C
- 工作温度范围：-55°C 至 155°C
- 封装尺寸：0603（1.60mm x 0.80mm）
- 高度：最大0.55mm
- 端子数：2
- 制造商：Yageo（国巨）
- 成分：厚膜
- 零件状态：有源
- 包装形式：卷带（TR）
性能特点
高功率处理能力：RC0603FR-0720KL 的额定功率为 100 mW，使其在大多数用途下具有良好的热管理能力，适用于高频率及稳定性的需求。
优良的温度稳定性：该电阻具有宽广的工作温度范围 -55°C 至 155°C，适合多种环境条件，这种温度适应能力是很多应用中不可或缺的特性。
小型化设计：0603 封装使得该电阻非常适合于空间有限的电路板设计，能够与其他表面贴装元件（SMD）完美结合，确保电子产品的整体小型化与轻量化。
高精度：±1%的容差和 ±100 ppm/°C 的温度系数确保了在各种工作条件下的测量精度。对于需要高精度应用的电路设计，RC0603FR-0720KL 能够有效地满足这些需求。
应用场景
RC0603FR-0720KL 贴片电阻广泛应用于多个领域，包括但不限于：
- 消费电子：如智能手机、平板电脑、便携式音响等设备中的信号处理和分压器电路。
- 工业设备：工业自动化设备、传感器和控制电路中稳定信号的传输和处理。
- 汽车电子：车辆中的传感器、控制单元，以及娱乐系统中的音频输出处理。
- 通讯设备：如无线设备、网络接口电路等，保证信号的稳定和可靠传输。
- 家用电器：在各种家庭电器中用作负载电阻或者与其他元件配合进行电压分配。
总结
RC0603FR-0720KL 贴片电阻凭借其出色的性能、精确的电阻值以及优良的温度适应能力，成为设计工程师在电路设计中的理想选择。其小巧的封装和高稳定性性能，能够满足现代电子设备对高集成度和可靠性的要求。不论是在消费电子、通讯、工业还是汽车领域，RC0603FR-0720KL 都能显示出其卓越的价值和广泛的应用潜力。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
