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YAGEO YC164-FR-0710KL Resistor Array YC164
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- YAGEO YC164-FR-0710KL
- Type
- YAGEO
- Unit
- Electronic Component
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- YAGEO
- Electronic Component
- YC164-FR-0710KL
- Electronic Component
- 1
- Package
- 0603x4
- Electronic Component
- Resistor Array
- Electronic Component
- ±1%
- Electronic Component
- 0.03g
- Electronic Component
- 10kΩ
- Electronic Component
- 8
- Electronic Component
- 1
- Electronic Component
- BM0227280052
- Electronic Component
- ±200ppm/℃
- Resistor
- 4
- Power
- 62.5mW
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
YC164-FR-0710KL 产品概述
一、产品概要
YC164-FR-0710KL 是 YAGEO（国巨）生产的一款四电阻阵列（4-resistor network），封装为 0603x4，8 引脚形式。单个电阻阻值为 10 kΩ，精度 ±1%，单元额定功率 62.5 mW，温度系数为 ±200 ppm/°C。该器件适用于在空间受限场合需要多路、配对或统一管理电阻的电路设计，能够替代四个独立的 0603 贴片电阻以节省 PCB 面积并简化装配流程。
二、主要参数
- 阻值：10 kΩ（每单元）
- 精度：±1%
- 单个元件功率：62.5 mW
- 温度系数（TCR）：±200 ppm/°C（即约 0.02%/°C）
- 电阻器数：4（独立单元）
- 引脚数：8
- 品牌：YAGEO（国巨）
- 封装：0603x4（四连体 0603）
三、特点与优势
- 节省空间：四电阻集成一个 0603x4 封装，PCB 占用面积明显小于四个分立电阻。
- 一致性好：同一封装内元件通常来源同一制造批次，有利于阻值匹配和热漂一致性。
- 可靠性高：减少焊点数和元件间连线，降低装配缺陷率与失效点。
- 便于生产：贴装工序和测试工序简化，适合自动化 SMT 贴装与回流焊。
四、典型应用
- 数字电路的上拉/下拉网络（MCU/GPIO）
- 模拟信号分压、偏置和输入阻抗设定
- ADC/DAC 输入端匹配与终端电阻
- 多通道滤波器和阻抗桥接电路
- 工业、消费电子、通信等对体积和一致性有要求的场合
五、选型与设计注意事项
- 温漂影响：±200 ppm/°C 表示温度变化 50°C 时，理论阻值漂移约 1.0%；在高精度或大温变环境下需考虑温漂补偿或选择更低 TCR 的元件。
- 功率余量：单元额定功率 62.5 mW，实际使用时建议留有裕量（例如不超过额定功率的 50–70%），并避免在靠近元件的 PCB 区域集中散热源。
- 串联/并联使用：若需要更高功率或不同阻值，可考虑器内串并接或外部组合，但需注意热耦合和额定功率限制。
- 公共端类型：确认是否为独立四电阻（8 引脚分别引出）或带公共端的阵列（本型号为 8 引脚、通常为独立四电阻），在电路连接上需核对封装引脚定义。
六、封装与 PCB 布局建议
- 采用厂商推荐的 0603x4 焊盘尺寸与焊接工艺参数，确保良好焊接强度与电气性能。
- 保持元件周围适当的散热铜皮，并避免在阵列附近放置高温器件以减少热互扰。
- 若需要测量单个电阻，留出测试点或测试夹具位置，方便生产在线测试。
七、可靠性与储存
- 遵循国巨推荐的储存条件（常温、干燥、防潮防氧化）与焊接前的烘烤要求（如有），以减少焊接缺陷和漂移。
- 在关键应用中建议进行实际环境下的寿命和温度循环测试，以验证长期稳定性。
如果需要，我可以根据具体电路（如最大工作电压、环境温度范围、功率分配）帮助计算功耗分配、温漂影响及更详细的 PCB 布局建议。
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