Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
YAGEO CC0805JRX7R9BB103 MLCC CC0805JRX7R9BB103
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- YAGEO CC0805JRX7R9BB103
- Type
- YAGEO
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- YAGEO
- Electronic Component
- CC0805JRX7R9BB103
- Electronic Component
- 1
- Electronic Component
- 10nF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.03g
- Electronic Component
- 1
- Electronic Component
- BM0229474139
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：CC0805JRX7R9BB103 - YAGEO陶瓷电容器
一、基本信息
CC0805JRX7R9BB103是一款由国巨（YAGEO）公司制造的高性能陶瓷电容器，具有出色的电气特性和广泛的应用场景。这款电容器采用0805（2012 公制）封装，主要用于表面贴装（MLCC）技术，适合现代电子电路的紧凑空间需求。其主要电气规格包括额定电压50V、电容值为10000pF（即10nF），温度范围为-55°C至125°C，并具有±5%的容差。
二、关键参数
尺寸与封装：
- 尺寸：2.00mm x 1.25mm（0.079" x 0.049"）
- 厚度：最大值为1.80mm（0.071"）
- 封装类型：0805（2012 公制）
电气性能：
- 电压额定值：50V
- 电容值：10000pF
- 容差：±5%
工作环境：
- 工作温度范围：-55°C至125°C
- 温度系数：X7R，具有优秀的温度稳定性和耐压性能。
三、应用场景
CC0805JRX7R9BB103陶瓷电容器由于其优异的性能，广泛适用于各种电子设备中。适合的应用场景包括但不限于：
- 消费电子：如智能手机、平板电脑、个人电脑等，应用在电源管理和信号筛选电路中。
- 工业设备：如传感器、控制器等，能满足高温和恶劣环境的需求。
- 通信设备：在无线和有线通信电路中，起到去耦合、滤波等作用。
- 汽车电子：适用于电动汽车和传统汽车中的各种电子控制单元（ECUs），提供稳定的电源和信号支持。
四、技术优势
高可靠性：YAGEO的陶瓷电容器在制造过程中采用严格的质量控制标准，确保电容器在各种应用中表现出色，能够承受高温和高压环境，适合长时间运行。
高容值与小尺寸：尽管体积小巧，CC0805JRX7R9BB103提供了高达10000pF的电容值，符合日益缩小的电子设计要求，使其非常适合现代高密度电路设计。
良好的温度特性：采用X7R温度系数，电容器在不同温度条件下表现稳定，适合各种工业和消费级应用。
多功能性：能够在多种电路功能中发挥作用，包括去耦、滤波、和短路保护等，有助于提高整体电路的性能和稳定性。
五、结束语
总结而言，CC0805JRX7R9BB103陶瓷电容器代表了现代电子元器件的优秀设计与性能，因其出色的电气特性、卓越的温度稳定性和广泛的应用范围，成为了许多电子产品中不可或缺的关键元件。对于工程师和设计师而言，选择这款电容器不仅能显著提高产品的性能，还能在产品的稳定性和可靠性方面提供有力保障。无论是在消费电子、汽车电子还是在工业自动化领域，CC0805JRX7R9BB103都是提升设计和性能的理想选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
