Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
YAGEO CC0402JPNPO9BN100 MLCC CC0402JPNPO9BN100
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- YAGEO CC0402JPNPO9BN100
- Type
- YAGEO
- Minimum package
- 50000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- YAGEO
- Electronic Component
- CC0402JPNPO9BN100
- Electronic Component
- 1
- Electronic Component
- 10pF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.013g
- Electronic Component
- 1
- Electronic Component
- BM0259741471
- Electronic Component
- NP0
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 50000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CC0402JPNPO9BN100 产品概述
一、产品概述
CC0402JPNPO9BN100 为 YAGEO（国巨）系列贴片多层陶瓷电容（MLCC），封装为 0402（1005 公制），标称容值 10 pF，容差 ±5%（J），额定电压 50 V，介质类型为 NP0（又称 C0G）。该器件以温漂极小、介电损耗低、频率特性优良而著称，适用于高精度、高稳定性电路场合。
二、主要参数与特性
- 容值：10 pF；精度：±5%
- 额定电压：50 V DC
- 温度系数：NP0（近零温度系数，典型为 ±30 ppm/°C 量级）
- 封装：0402（约 1.0 mm × 0.5 mm，厚度约 0.45 mm，具体以数据表为准）
- 特性：低温漂、低介质损耗、极佳的频率响应和高 Q 值；对 DC 偏压敏感性小，容量随时间几乎不衰减（无显著老化现象）。
三、典型应用
适用于对容量稳定性和低损耗有严格要求的场合，例如高频滤波、谐振回路、时钟与振荡电路、ADC/DAC 采样前端、射频匹配及精密测量仪器等。此外在消费类、通信、汽车电子（满足相应规格时）中也常用作耦合与去耦元件。
四、设计与焊接建议
- 焊接：建议按厂家推荐的无铅回流曲线进行，遵循 JEDEC/IPC 标准，避免反复重流。峰值温度与保温时间请参照数据表。
- 贴片与布局：0402 尺寸小，布线应尽量缩短走线与过孔，避免机械应力集中；焊盘设计参考厂商 APP NOTE 或 IPC 指南以保证焊接可靠性。
- 电压与去耦：NP0 不需像高介电常数材料那样进行大幅度电压降额，但在高应力或高可靠性场景，应遵循系统级的降额规则和寿命设计准则。
- 贮存与装配：避免受潮与机械冲击，使用卷带（Tape & Reel）贴片供货时按厂家建议回流前干燥处理（如适用）。
五、采购与质量建议
- 采购时核对完整料号与数据表，关注温漂等级 NP0 与封装尺寸，避免混淆 X7R、NP0 等介质类型。
- 常见替代品牌包括 Murata、TDK、KEMET 等同类 NP0 0402 产品，选型时比对温度系数、频率特性与可靠性数据。
- 量产前建议获取厂商样品并做电气与热循环、机械应力等可靠性验证，以确保在目标应用环境下性能稳定。
总体而言，CC0402JPNPO9BN100 以其极好的温度稳定性与低损耗特性，是对精度与频率响应有高要求电路的优选器件。具体尺寸、回流曲线与可靠性参数请以 YAGEO 官方数据表为准。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
