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YAGEO RC0100FR-07200KL Resistor RC0100FR
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- YAGEO RC0100FR-07200KL
- Type
- YAGEO
- Unit
- Electronic Component
- Minimum package
- 20000 圆盘
Technical parameters
- Power
- 31.25mW
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- YAGEO
- Electronic Component
- RC0100FR-07200KL
- Electronic Component
- 1
- Package
- 01005
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.007g
- Electronic Component
- 200kΩ
- Electronic Component
- 1
- Electronic Component
- BM0265967398
- Operating Temperature
- 55℃~+125℃
- Electronic Component
- ±200ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
国巨RC0100FR-07200KL厚膜片式电阻产品概述
一、产品基本定位与核心标识
该产品是国巨（YAGEO） 推出的超小型表面贴装厚膜电阻，型号为RC0100FR-07200KL，针对高密度、小体积电子设备设计，兼顾精度稳定性与宽温适应性，是消费电子、可穿戴设备等领域的主流选型之一。
二、关键电气参数详解
参数类型 具体规格 实际意义说明 阻值与精度 200kΩ ±1% 满足分压、信号衰减等对阻值一致性要求较高的电路，避免因阻值偏差导致信号失真 额定功率 1/32W（31.25mW） 适配低功耗小信号电路，无过热风险，适合电池供电的便携式设备 温度系数（TCR） ±200ppm/℃ 温度每变化1℃，阻值波动0.02%（200kΩ对应40Ω波动），宽温下性能稳定 工作温度范围 -55℃ ~ +125℃ 覆盖工业级、消费电子级的典型环境，可在极端温度（如户外智能手表、车载模块）下工作三、封装与物理特性
该产品采用01005超小型表面贴装封装（英制：0.01"×0.005"，公制：约0.254mm×0.127mm），是目前片式电阻中体积最小的封装之一：
- 体积仅为传统0402封装的1/16，可显著提升PCB布线密度，助力终端产品“轻薄化”（如智能手表厚度可控制在10mm以内）；
- 基底为高稳定性氧化铝陶瓷，厚膜电阻浆料采用国巨自研配方，确保批量生产一致性；
- 焊盘设计适配无铅回流焊工艺（符合RoHS标准），支持自动化贴片生产，降低客户制程难度。
四、典型应用场景
- 消费电子终端：智能手机、平板的WiFi/Bluetooth模块偏置电阻、音频电路音量控制电阻，利用小封装实现机身紧凑；
- 可穿戴设备：智能手表、手环的心率传感器滤波电阻、低功耗蓝牙模块匹配电阻，满足“轻薄化”设计需求；
- 工业小型模块：工业温度/压力传感器信号放大电路、PLC I/O接口电阻，宽温范围适配现场温度波动；
- 医疗便携式设备：血糖仪、血压计的信号处理电路，小体积适配手持设备空间限制，宽温保证测量精度；
- 车载辅助电路：胎压监测模块辅助电阻，宽温特性适配车载环境（-40℃~85℃）的温度变化。
五、产品核心优势
- 超小体积与高密度集成：01005封装可在相同PCB面积内集成更多电阻，降低终端产品尺寸与重量；
- 宽温稳定性：±200ppm/℃的TCR与-55℃~+125℃的工作范围，解决户外设备、工业现场的温度波动问题；
- 高精度一致性：±1%精度满足分压、基准电路要求，国巨批量工艺确保同一批次阻值偏差极小；
- 高可靠性：厚膜结构耐振动、抗冲击（符合IEC 60068-2-6振动标准），陶瓷基底抗湿、抗腐蚀，长期使用阻值漂移<0.5%；
- 环保与制程兼容：符合RoHS/REACH标准，适配无铅回流焊，支持自动化生产，降低客户成本。
六、适用注意事项
- 功率降额：125℃环境下需降额至额定功率的50%以下，避免过热失效；
- 焊接工艺：回流焊峰值温度≤260℃，焊接时间≤10秒，防止封装损坏；
- 静电防护：01005封装对ESD敏感，生产需采用防静电工作台、离子风扇等防护措施。
该产品凭借“小体积、高精度、宽温稳定”的特性，成为国巨针对小型化电子设备的核心厚膜电阻型号之一，广泛应用于全球消费电子与工业领域。
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