WMSIC Electronic Components

YAGEO RC1206FR-073K3L Resistor RC1206FR

ModelRC1206FR-073K3L
Package1206
BrandYAGEO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YAGEO RC1206FR-073K3L
Type
YAGEO
Minimum package
5000 圆盘

Technical parameters

Power
250mW
Electronic Component
Electronic Component
Electronic Component
YAGEO
Electronic Component
RC1206FR-073K3L
Electronic Component
1
Package
1206
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.03g
Electronic Component
3.3kΩ
Electronic Component
1
Electronic Component
BM0000001907
Operating Temperature
55℃~+155℃
Operating Voltage
200V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:RC1206FR-073K3L

RC1206FR-073K3L 是一款高性能的贴片电阻,属于 YAGEO(国巨)品牌产品系列。该电阻采用了厚膜技术,具有卓越的稳定性和可靠性,适用于多种电子应用场景。

基本特性

  • 电阻值: 3.3 kΩ
  • 容差: ±1%
  • 功率额定值: 0.25W(1/4W)
  • 工作温度范围: -55°C 到 155°C
  • 温度系数: ±100ppm/°C
  • 封装尺寸: 1206(长0.122" x 宽0.063" / 3.10mm x 1.60mm)
  • 安装高度: 最大0.026"(0.65mm)
  • 端子数: 2

材料与工艺

RC1206FR-073K3L 使用的是先进的厚膜工艺,这种工艺在制造过程中通过将电阻材料沉积在陶瓷基板上,形成一个稳定的电阻元件。这种设计确保了其在各种环境下的长期可靠性,特别适合高温及高湿度条件下的应用。

应用领域

RC1206FR-073K3L 贴片电阻广泛应用于各种消费电子、工业设备及汽车电子产品中。其设计使其非常适合用于以下应用:

  • 电源管理
  • 信号处理
  • 器件保护
  • 模拟电路及数字电路

性能优越

该电阻的容差为±1%,提供了良好的电气特性,使其在精密电路设计中成为理想选择。此外,其温度系数的稳定性(±100ppm/°C)确保在温度变化时仍能保持可靠的电阻值,从而有效降低了因环境变化引起的电路失效风险。

散热与功耗

RC1206FR-073K3L 的额定功率为0.25W,适合在大多数中低功耗应用中使用。它的薄型封装设计(最大高度仅为0.026")使其能够在空间受限的设备中获得更好的适应性,并能有效散热,确保电路的稳定运行。

安装与兼容性

RC1206FR-073K3L采用标准1206封装,适配于各类贴片装配技术,包括波峰焊和回流焊。这使得其能够方便地融入各种电路板的生产过程中,降低生产成本,提高生产效率。

结论

总结来说,RC1206FR-073K3L是一款具有优良性能和可靠性的厚膜贴片电阻,适用于多种电气和电子应用。其出色的温度稳定性、精确的电阻值以及广泛的应用范围,使得它在现代电子设计中不可或缺。无论是在消费电子、工业设备还是汽车电子领域,RC1206FR-073K3L都能为设计人员提供卓越的效率与可靠性,是高品质电子产品的理想选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.