Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
YAGEO CC0603KRX7R9BB152 MLCC CC0603KRX7R9BB152
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- YAGEO CC0603KRX7R9BB152
- Type
- YAGEO
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- YAGEO
- Electronic Component
- CC0603KRX7R9BB152
- Electronic Component
- 1
- Electronic Component
- 1.5nF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.023g
- Electronic Component
- 1
- Electronic Component
- BM69414955
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：CC0603KRX7R9BB152 贴片电容
基本信息
产品型号：CC0603KRX7R9BB152
电容值：1500pF (1.5nF)
容差：±10%
额定电压：50V
温度系数：X7R
工作温度范围：-55°C ~ 125°C
安装类型：表面贴装 (MLCC)
封装/外壳：0603 (1608公制)
外形尺寸：0.063" 长 x 0.031" 宽 (1.60mm x 0.80mm)
厚度（最大值）：0.035" (0.90mm)
品牌：YAGEO (国巨)
产品描述
CC0603KRX7R9BB152是一种高性能的贴片电容器，属于多层陶瓷电容器（MLCC）系列。这款电容器具有1500pF的电容值，额定电压为50V，适用于各种电子电路中的应用需求。作为一种广泛应用的通用组件，它提供了良好的电气性能，尤其是在高频应用和高速转换电路中表现优异。
特点与优势
高电气性能：CC0603KRX7R9BB152具有较低的ESR（等效串联电阻）和ESL（等效串联电感），使其在高频率、快速切换的电路中表现出色，能够有效地抑制高频噪声并保持信号完整性。
稳定性与可靠性：采用X7R温度系数，该电容在较宽的温度范围内（-55°C至125°C）能够保持良好的电容量稳定性。X7R陶瓷电容器在受到电压和温度变化时，其电容值的变化相对较小，适合应用在温度波动较大的环境中。
表面贴装技术（SMD）：0603封装形式使得CC0603KRX7R9BB152非常适合现代电子设备的自动化生产。小型化的外形能够有效节省PCB板空间，有助于提高整体电路设计的密度和性能。
优良的抗老化性能：陶瓷材料具备优异的耐热性与抗电化学效应，确保电容器在长时间使用过程中维持其电特性，降低了故障率，提高了整体可靠性。
应用领域
由于其优异的性能与广泛的兼容性，CC0603KRX7R9BB152电容器可以被广泛应用于多个领域，包括但不限于：
消费电子：在手机、平板电脑和其他便携式设备中用作去耦电容、滤波电容及旁路电容，确保设备的正常运行及信号的清晰传输。
工业设备：用于工业控制系统、传感器及自动化设备中，以提高系统的稳定性和可靠性。
通讯设备：广泛应用于各种通讯模块和基站中，作为稳定电源的去耦电容，支持信号调制与解调过程。
汽车电子：在车载电子系统中，处理各种高频信号及电源管理，以确保车辆的信息安全和通讯的稳定。
结论
CC0603KRX7R9BB152贴片电容器是一款具备高可靠性、良好电性能与广泛适用性的多层陶瓷电容器。凭借其出色的热稳定性、低损耗特性及表面贴装设计，适合现代电子产品的需求，不论是消费类电子，还是工业与通讯设备，均能发挥重要作用。其品牌YAGEO (国巨) 也为产品质量与性能提供了有力的保证，是电子工程师和设计师的理想选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
