WMSIC Electronic Components

YAGEO YC124-JR-0733RL Resistor Array YC124

ModelYC124-JR-0733RL
Package0402x4
BrandYAGEO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
YAGEO YC124-JR-0733RL
Type
YAGEO
Unit
Electronic Component
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
YAGEO
Electronic Component
YC124-JR-0733RL
Electronic Component
1
Package
0402x4
Electronic Component
Resistor Array
Electronic Component
±5%
Electronic Component
0.012g
Electronic Component
33Ω
Electronic Component
8
Electronic Component
1
Electronic Component
BM0253996291
Electronic Component
±200ppm/℃
Resistor
4
Power
62.5mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

YC124-JR-0733RL 产品概述

一、产品简介

YC124-JR-0733RL 为国巨(YAGEO)推出的一款四位排阻网络,封装为 0402x4(共 8 引脚)。每位阻值 33Ω,公差 ±5%,单个元件额定功率 62.5mW,温度系数(TCR)为 ±200ppm/℃,适合高密度 SMT 板上集成应用。

二、主要参数

  • 阻值:33Ω(每位)
  • 元件数:4(排阻)
  • 公差:±5%
  • 单位功率:62.5mW(每位)
  • 温度系数:±200ppm/℃
  • 引脚数:8
  • 封装:0402x4(SMD)
  • 品牌:YAGEO(国巨)

三、产品特点与优势

  • 小型化封装,适合高密度布局与便携设备。
  • 四位一体化设计,节省 PCB 面积并简化组装流程(统一贴装、统一回流)。
  • 标称阻值与公差适用于一般去耦、限流与阻抗匹配场景。
  • TCR ±200ppm/℃ 在一般环境温度变化下保持稳定性,满足多数消费类与工业类应用需求。

四、典型应用

  • 信号线终端与阻抗匹配
  • 串联限流与简单分压电路
  • 多通道滤波或偏置电路的统一排阻解决方案
  • 消费电子、通信设备、工业控制板的高密度布板

五、电气与热设计建议

  • 单位功率 62.5mW,0402x4 封装热阻较高,设计时应留有热扩散通道或适度降额,避免靠近高热源器件。
  • 若长期在高温环境或连续负载工作,建议按 50% 或更低的功率因子降额设计以提高可靠性。
  • 对精密模拟或时基电路,±5% 和 ±200ppm/℃ 的规格可能不足,应评估是否选择更高精度/低 TCR 产品。

六、焊接与储存建议

  • 推荐采用行业通用回流焊工艺进行安装(详见厂商数据手册中的温度曲线),避免超出峰值温度限制并减少两次以上重复热循环。
  • 储存时注意防潮、防污染,按供应商包装与干燥条件管理,以保证可焊性与性能稳定性。

七、资料与采购建议

  • 使用前建议参考 YAGEO 官方数据手册以获取完整的尺寸图、焊盘建议、可靠性试验数据及回流曲线。
  • 如需更高精度或更低温漂的排阻,可与供应商沟通替代型号或定制方案。

如需我帮忙查找该型号的详细数据手册、PCB 封装库 (footprint) 或给出具体的降额计算与热仿真建议,请告知您的使用场景与环境条件。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.