Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
YAGEO RT0402BRD0727KL Resistor RT0402BRD0727KL
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- YAGEO RT0402BRD0727KL
- Type
- YAGEO
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 62.5mW
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- YAGEO
- Electronic Component
- RT0402BRD0727KL
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Resistor
- Electronic Component
- ±0.1%
- Electronic Component
- 0.009g
- Electronic Component
- 27kΩ
- Electronic Component
- 1
- Electronic Component
- BM0258729777
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 50V
- Electronic Component
- ±25ppm/℃
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RT0402BRD0727KL 产品概述
一、产品简介
RT0402BRD0727KL 是国巨（YAGEO）系列的一款高精度薄膜贴片电阻，封装为 0402（公制 1005），阻值 27 kΩ，精度 ±0.1%，额定功率 1/16W（62.5 mW），适用于对阻值稳定性、低噪声和高温度稳定性有较高要求的精密电子电路。其温度系数（TCR）仅为 ±25 ppm/℃，工作温度范围宽（-55℃ 至 +155℃），适合长期可靠工作环境。
二、主要参数
- 阻值：27 kΩ
- 精度：±0.1%
- 功率：62.5 mW（1/16W）
- 最大工作电压：50 V
- 温度系数：±25 ppm/℃
- 工作温度范围：-55℃ ～ +155℃
- 封装：0402（1005）
- 结构：薄膜电阻（低噪声、高稳定性）
- 品牌：YAGEO（国巨）
三、性能特点
- 高精度：±0.1% 公差可确保电路中阻值配比和漂移控制，适合精密分压、放大器反馈网络等场合。
- 低 TCR：±25 ppm/℃ 的温漂性能，有利于在温度变化下维持稳定输出，适合测量和采样精度敏感的系统。
- 低噪声与高稳定性：薄膜工艺带来更低的噪声系数和更好的长期稳定性，优于一般厚膜电阻。
- 小型化：0402 小封装节省 PCB 面积，利于高密度布线与便携设备设计。
- 宽温度范围与可靠性：广泛适应工业级和高温环境。
四、典型应用
- 精密仪表与测量仪器（ADC 输入、采样网络）
- 放大器与参考电路（反馈阻、增益设定）
- 通信与测试设备（衰减器、匹配网络）
- 医疗电子、传感器接口（低漂移要求场合）
- 消费电子中对尺寸和精度有要求的电路
五、封装与焊接建议
- 采用标准 0402 PCB 尺寸和焊盘设计，建议预留一定焊盘与元件间距以便焊接质量。
- 焊接工艺应遵循国巨提供的回流焊曲线，避免超温或过长时间的热应力，以保证阻值稳定性与可靠性。
- 对于功率与热管理关键电路，建议在布局时考虑散热路径并保留安全裕度，避免长时间接近额定功率运行。
六、可靠性与储存
- 在长期存放或使用前，避免潮湿与腐蚀性气体环境，建议密封干燥包装并遵循厂家储存说明。
- 在高应力环境（如频繁高温循环、机械振动）中，建议做额外的可靠性验证。
- 对于关键安全类应用，应结合实际应用场景参考供应商的详细可靠性与寿命数据。
七、选型与替代建议
如需保持相同精度/封装而调整阻值，可在国巨同系列查找相近型号；若对温漂或长期稳定性有更高要求，可考虑更高等级薄膜或增配温度补偿电路。下单时请确认完整料号与库存，并与供应商核对 RoHS/REACH 等合规性文件。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
