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YAGEO CC0402KRX7R8BB471 Capacitor CC0402KRX7R8BB471
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- YAGEO CC0402KRX7R8BB471
- Type
- YAGEO
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- YAGEO
- Electronic Component
- CC0402KRX7R8BB471
- Electronic Component
- 1
- Electronic Component
- 470pF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.009g
- Electronic Component
- 1
- Electronic Component
- BM0258729385
- Electronic Component
- X7R
- Voltage
- 25V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CC0402KRX7R8BB471 产品概述
一、产品简介
CC0402KRX7R8BB471 为 YAGEO（国巨）出品的贴片多层陶瓷电容（MLCC），封装为 0402（1005 公制），标称电容 470 pF，容差 ±10%，额定电压 25 V，介质型式 X7R。该系列面向高密度表贴组装，适配现代 SMT 贴片工艺，体积小、可靠性高，广泛用于消费电子、通信、工业控制等场合。
二、主要电气与温度特性
- 标称电容：470 pF（代码 471，47×10^1 pF）
- 容差：±10%（初始精度）
- 额定电压：25 V DC
- 介质：X7R（工作温度 -55°C 至 +125°C，温度范围内电容量变化 ≤ ±15%）
- 介质特性：介电常数较高，体积/容量比优良，但存在温漂与直流偏置（DC bias）效应，随温度及偏压会有一定容量衰减。
三、机械与封装信息
- 封装：0402（约 1.0 mm × 0.5 mm）
- 适配表面贴装与高密度 PCB 设计，推荐采用卷带包装以配合自动贴片机。
- 结构坚固，耐振动与热循环性能良好，适合批量生产的回流焊工艺。
四、典型应用场景
- 高频去耦、旁路与 EMI 抑制（尤其针对高频分量）
- 谐振与滤波网络（对容差和稳定性要求不极高的场合）
- 耦合、阻尼与分压网络中的小容量元件
- 手机、无线模块、基站、功率管理与工业控制电路中的通用滤波/去耦
五、选型与使用注意事项
- 若电路对温漂或相位噪声有严格要求（如高精度振荡器、滤波器、时间基准），建议考虑 C0G/NP0 型陶瓷电容；X7R 更适合一般去耦与滤波。
- MLCC 存在显著的 DC bias 效应，施加接近额定电压时有效电容可能下降，设计时应留有裕量或进行实测确认。
- 推荐遵循厂商推荐的 PCB 焊盘尺寸与回流焊曲线（参照 J-STD-020），避免过长的高温暴露以减少热应力。
- 储存与搬运时注意防潮、防机械压裂，贴片前避免过度弯曲或挤压。
六、可靠性与包装
- YAGEO 系列 MLCC 具有良好的电气稳定性与长期可靠性，适合连续生产环境。
- 常见为卷带（tape & reel）包装，便于自动化 SMT 贴装；具体包装规格请参照产品数据手册与代理商信息。
总结：CC0402KRX7R8BB471 是一款兼顾体积与性能的通用贴片电容，适合对体积和温度范围有要求但对极高精度无特殊需求的去耦与滤波场合。选型时请重点关注 DC bias、温度系数与实际焊接工艺对电容性能的影响，必要时在电路环境下进行实测验证。
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