Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
YXC X201632MKB4SI Crystal X201632MKB4SI
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- YXC X201632MKB4SI
- Type
- SMD2016-4P
- Minimum package
- 3000
Technical parameters
- Electronic Component
- YXC
- Electronic Component
- X201632MKB4SI
- Electronic Component
- 1
- Package
- SMD2016-4P
- Electronic Component
- Passive Crystal Oscillator
- Electronic Component
- 0.031g
- Frequency
- 32MHz
- Electronic Component
- 1
- Electronic Component
- BM0228538329
- Operating Temperature
- 40℃~+85℃
- Electronic Component
- ±10ppm
- Crystal Oscillator Type
- SMDCrystal Oscillator
- Load Capacitor
- 8pF
- Frequency
- ±20ppm
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
X201632MKB4SI 产品概述
一、产品简介
X201632MKB4SI 是 YXC（扬兴科技）推出的一款无源贴片晶振，中心频率 32.000MHz，封装为 SMD2016-4P（2.0 × 1.6 mm）。本器件为高可靠性、低相位噪声的贴片晶体，适用于对时钟精度有较高要求的 MCU、数字系统和通信设备等场合。
二、主要技术参数
- 晶振类型：无源晶振（贴片晶振）
- 频率：32.000 MHz
- 常温频差：±10 ppm（室温）
- 负载电容：8 pF（CL）
- 频率稳定度（温度范围内）：±20 ppm
- 工作温度：-40 ℃ ~ +85 ℃
- 封装：SMD2016-4P（四引脚贴片）
- 品牌：YXC 扬兴科技
三、性能特点
- 小尺寸、贴片化封装，适合高密度 PCB 设计；
- 优良的频率稳定性与精度（常温 ±10ppm，温度范围内 ±20ppm），满足大多数工业级时钟需求；
- 指定 8 pF 负载电容，便于与常见石英振荡电路直接配合；
- 无源器件本身不含驱动电路，能量消耗低，由系统内的晶振驱动器供激励，适配性强。
四、典型应用
- 嵌入式微控制器（MCU）系统时钟；
- 通信设备与网络接口时钟源；
- 高速数字信号处理（DSP）、音频/视频处理器时钟；
- 工业控制、仪表及消费电子产品对稳定时钟的场合。
五、选型与实用建议
- 负载电容匹配：若 PCB 上的寄生电容（Cstray）约为 1–3 pF，建议两侧耦合电容 C1 = C2 = 2×(CL − Cstray)。例如 Cstray ≈ 2 pF 时，C1 ≈ C2 ≈ 12 pF；实际取值应以目标电路振荡器稳定性为准。
- 布局：晶体应尽量靠近 MCU 的晶振引脚放置，走线最短且对称，避免经过大面积地铜或噪声源附近。为减小串扰，振荡器周边应做接地隔离。
- 焊接：采用无铅回流工艺时，请参照厂商资料确认回流曲线与最大温度；贴装、回流操作避免超过晶体的热应力极限。
- 防静电与存储：无源晶体对静电敏感，生产与装配过程注意 ESD 防护；长期存放请置于干燥、防潮包装中并避免剧烈震动。
六、可靠性与测试
X201632MKB4SI 按工业温度等级设计（-40 ℃ 至 +85 ℃），在正常使用条件下具有良好的温度稳定性与抗振动性能。出货前通常经过频率、负载、外观与焊接可靠性等测试。具体老化率、相位噪声和加速寿命测试数据请参见 YXC 扬兴科技的详细数据手册或向厂商索取认证报告。
总结：X201632MKB4SI 以其小型封装、优良的频率精度与工业级温度范围，适合需要稳定 32MHz 时钟源的各类电子设备。选型与设计时建议结合实际电路负载和板级寄生参数进行配合，并遵循厂商的封装与焊接指南以保证性能与可靠性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
