WMSIC Electronic Components

YXC OT252016MJBA4SL Oscillator OT252016MJBA4SL

ModelOT252016MJBA4SL
PackageSMD2520-4P
BrandYXC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YXC OT252016MJBA4SL
Type
SMD2520-4P
Minimum package
3000 个

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YXC
Electronic Component
OT252016MJBA4SL
Electronic Component
1
Package
SMD2520-4P
Electronic Component
Active Crystal Oscillator
Electronic Component
0.025g
Frequency
16MHz
Electronic Component
1
Electronic Component
BM0230110417
Operating Temperature
40℃~+85℃
Operating Voltage
1.8V~3.3V
Operating Current
4mA
Electronic Component
±10ppm
Output
CMOS
Frequency
±20ppm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

OT252016MJBA4SL 有源晶振产品概述

一、产品简介

OT252016MJBA4SL 是扬兴科技(YXC)推出的一款小型有源晶振,工作频率为 16.000 MHz,采用 CMOS 单端输出,适配 1.8V 至 3.3V 的宽电源范围。器件封装为 SMD2520-4P(约 2.5 × 2.0 mm 小体积),工作温度范围 -40°C 至 +85°C,常温初始频差 ±10 ppm,频率温度稳定度可达 ±20 ppm,静态工作电流典型值约 4 mA。该产品针对空间受限与低功耗设计场景,兼顾频率精度与系统兼容性,适用于各类数字系统时钟源。

二、主要规格亮点

  • 频率:16.000 MHz,满足常见 MCU、FPGA、通信与音频时钟需求。
  • 输出模式:CMOS 单端输出,逻辑高低电平兼容 1.8V/2.5V/3.3V 体系。
  • 电源范围:1.8 V ~ 3.3 V,支持低电压系统与传统 3.3 V 系统。
  • 工作电流:约 4 mA(典型值),适合对功耗有一定要求的电池供电应用。
  • 频率性能:常温初始偏差 ±10 ppm,频率稳定度(含温度、寿命等因素)±20 ppm。
  • 工作温度:-40°C 至 +85°C,适合工业级环境使用。
  • 封装:SMD2520-4P 小体积贴片,利于高密度 PCB 布局与自动化贴装。

三、功能与应用场景

OT252016MJBA4SL 作为一枚有源晶振,内置振荡电路输出稳定时钟信号,无需外接晶体管或负载电容,方便快捷。典型应用包括但不限于:

  • 单片机(MCU)与微处理器系统主时钟;
  • 无线通信模块(BLE、ZigBee、LoRa 等)与射频基带参考;
  • 消费类电子与可穿戴设备;
  • 工业控制、数据采集、传感器节点与物联网终端;
  • 数字音频与视频设备的时钟同步。

其小尺寸与低功耗特性,使其尤其适合空间和功耗受限的移动与嵌入式设备。

四、设计注意事项与推荐做法

  • 去耦电容:建议将 0.01 μF 至 0.1 μF 的高品质陶瓷去耦电容贴近器件 VCC 与 GND 引脚,以抑制电源噪声。
  • 电源滤波:在电源线上可增加电感/滤波器以减少电磁干扰对振荡稳定性的影响。
  • 布局要求:输出引线尽量短且直,避免在输出线附近布置高速差分线与大面积铜层,以降低串扰与地回路噪声。
  • 上电顺序:确保电源稳定后再使能关键逻辑,以免在上电瞬间输出干扰系统复位判定。
  • 焊接工艺:器件兼容常见的无铅回流焊工艺,建议遵循供应商提供的回流温度曲线与焊接说明以保证良好可靠性。

如需输出使能/三态控制等特殊功能,请以厂方数据手册为准。

五、可靠性与供货信息

OT252016MJBA4SL 在典型工业温度范围内工作,并通过常规制造与出货测试以保证频率与电气参数的稳定性。产品可按卷带(Tape & Reel)方式提供,便于 SMT 贴装与大批量生产。关于包装规格、出货量、以及特殊需求(如筛选等级、频率检定证书等),建议直接联系扬兴科技或授权代理商获取详细支持与最新数据手册。

六、选型建议

当系统需要 16 MHz、CMOS 输出且对体积与功耗有严格控制时,OT252016MJBA4SL 是一个合适的选择。若应用对相位噪声、抖动或频率稳定度有更高要求,请向厂商索取完整的时域/频域测量数据或考虑高端时钟源产品线。

如需样品、最新规格书或技术支持,请联系扬兴科技(YXC)或当地分销商以获取第一手资料。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.