Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
YXC X49SM8MSB2SC Crystal Oscillator X49SM8MSB2SC
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- YXC X49SM8MSB2SC
- Type
- HC-49S-SMD
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- YXC
- Electronic Component
- X49SM8MSB2SC
- Electronic Component
- 1
- Package
- HC-49S-SMD
- Electronic Component
- Passive Crystal Oscillator
- Electronic Component
- 1.013g
- Frequency
- 8MHz
- Electronic Component
- 1
- Electronic Component
- BM0177343375
- Operating Temperature
- 20℃~+70℃
- Electronic Component
- ±10ppm
- Crystal Oscillator Type
- SMDCrystal Oscillator
- Load Capacitor
- 20pF
- Frequency
- ±30ppm
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：X49SM8MSB2SC 无源晶振 8MHz 20pF ±10ppm 贴片晶振
产品简介
X49SM8MSB2SC是一款高性能的无源晶振，工作频率为8MHz，采用HC-49S-SMD封装技术，具有极小的体积和优异的频率稳定性。这款晶振由扬兴科技（YXC）生产，旨在满足各种电子设备对时基参考信号的严格要求，广泛应用于通信、自动控制、消费电子和工业电子等领域。
关键特性
- 频率：8MHz - X49SM8MSB2SC在8MHz的工作频率下，能够为各种电子电路提供稳定的时钟信号。
- 负载电容：20pF - 该晶振设计具有20pF的负载电容，使其能够与多种电路配置相匹配，确保了最佳的频率稳定性和性能。
- 频率精度：±10ppm - 精密的频率偏差容限表现，适用于对时基要求极高的应用场合。
- 封装类型：HC-49S-SMD - 采用表面贴装技术（SMD），使得该晶振适合现代电子设备的小型化设计，方便PCB布局和自动化生产。
应用领域
X49SM8MSB2SC晶振可广泛应用于如下领域：
- 通信设备：如路由器、交换机、手机等设备中，作为核心信号的基准源，确保数据传输的稳定性和准确性。
- 消费电子：在智能手表、智能家居产品等消费类电子产品中，担任时钟源的角色，以实现精准的时间管理和操作响应。
- 工业控制：应用于自动化控制系统，使得设备之间的数据同步和协作更加高效，提升整个生产流程的可靠性。
- 医疗设备：在各种医疗电子设备中，如监测器和诊断仪器，提供可靠的频率基准，确保测量结果的准确性。
性能优势
X49SM8MSB2SC不仅在频率精度和负载电容方面表现出色，同时其无源特性降低了功耗，延长了设备的使用寿命。晶振的封装紧凑，适应了现代电子产品的小型化趋势，并且其较低的成本使得在大规模生产中具有良好的竞争力。
安装和使用
该产品的SMD封装设计允许其在自动化生产线上的快速安装和焊接，确保了高效的生产流程。在使用时，设计工程师需要根据电路设计要求计算负载电容，以确保晶振能够在最佳性能下工作。此外，由于其特殊的封装形式，建议在焊接时遵循适当的温度曲线和时间控制，以防止过热导致产品失效。
结论
总体而言，X49SM8MSB2SC无源晶振是一款集成稳定性、精度与适用性于一体的高性能时钟源元器件。凭借其优质的参数和出色的制造工艺，X49SM8MSB2SC将为电子产品的设计与创新提供强有力的支持，是电子工程师的理想选择。随着科技的进步和对电子产品性能的日益追求，该晶振的市场需求将持续增长，成为未来电子设计的核心组成部分。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
