Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
YJYCOIN YSPI1365-470M YSPI1365
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- YJYCOIN YSPI1365-470M
- Type
- YJYCOIN
- Minimum package
- 500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- YJYCOIN
- Electronic Component
- YSPI1365-470M
- Electronic Component
- 1
- Package
- SMD,13.8x12.6mm
- Type
- Inductor
- Electronic Component
- Power Inductor
- Electronic Component
- ±20%
- Electronic Component
- 4.14g
- Inductor
- 47uH
- Electronic Component
- 1
- Electronic Component
- BM0084336601
- Current
- 5A
- Resistor(DCR)
- 80mΩ
- Electronic Component
- Electronic Component
- Electronic Component
- 500
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：YSPI1365-470M 功率电感
一、基本信息
产品名称：YSPI1365-470M
类型：功率电感
阻抗：57.5mΩ
电感值：47μH ±20%
最大电流：5A
封装类型：SMD（表面贴装）
尺寸：13.8mm x 12.6mm x 6.5mm
品牌：YJYCOIN（益嘉源）
二、产品特点
YSPI1365-470M是一款高性能的功率电感，特别适合用于需要高电流和低直流电阻（DCR）的应用中。其57.5mΩ的低阻抗设计，使得该电感在高负载工作时能有效减少能量损耗，提升电路的整体效率。同时，由于其47μH的电感值和±20%的容差，YSPI1365-470M能够满足多种应用需求。
三、应用场景
开关电源：由于其高电流承载能力和较低的DCR，YSPI1365-470M非常适合用于开关电源（SMPS），可以帮助改善转换效率，降低发热量。
DC-DC转换器：在DC-DC转换器中，电感器的角色至关重要。YSPI1365-470M可以用于升压和降压转换器中，提供必要的电流和抗干扰性。
电池管理系统：该电感在电池管理系统中可帮助平衡和保护电池单元，提高整体系统的安全性和稳定性。
汽车电子：随着新能源汽车的普及，YSPI1365-470M可以在电动驱动、充电桩和电池管理系统等汽车电子设备中发挥重要作用，确保其高效运行。
消费电子产品：该电感还可用于各种消费电子产品如智能手机、平板电脑等，用于滤波和储能等功能。
四、技术规格
- 高电流承载：YSPI1365-470M具备5A的最大直流工作电流，可以在恶劣的工作环境下稳定运行。
- 低温升特性：因其低阻抗特性，电感在工作中产生的热量极少，能够有效提高使用寿命。
- 高可靠性：得益于优质材料的选用，这款电感的耐用性和抗潮湿性优越，在各种环境条件下均能保持良好的性能。
五、封装与布局
YSPI1365-470M采用SMD封装，便于自动化生产线作业。其尺寸为13.8mm x 12.6mm x 6.5mm，使其易于集成到密集的电路板布局中，适用于空间受限的场合。同时，其封装设计也有助于降低电磁干扰（EMI），提升整体电路的稳定性和可靠性。
六、结论
YSPI1365-470M是一款集高效、可靠和多功能于一体的功率电感，适用于多种电子设备和系统。凭借其卓越的性能表现和优质的制造工艺，YSPI1365-470M将在广泛的市场应用中，提供稳定的电感支持，持续推动电子技术的发展与创新。无论是在消费电子、汽车电子还是工业应用中，YSPI1365-470M都可以作为必不可少的关键元件，为设备的高效运行提供重要保障。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
