Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
YSPIT0730A-2R7M是益嘉源(YJYCOIN)推出的SMD贴片式一体成型功率电感,专为中大功率电子设备的电源回路设计,聚焦「大电流承载、低损耗、紧凑封装」三大核心需求,适配高密度PCB布局场景。该产品采用一体化磁芯封装工艺,兼具可靠性与电磁兼容性,是电源设计中替代传统绕线电感的优选方案。
标称电感值为2.7μH,精度±20%,符合工业级电子元器件的误差标准。该电感量适配多数DC-DC转换器的滤波/储能需求(如12V转低电压的降压电路),误差范围可通过电路补偿满足设计要求,无需过度依赖高精度电感。
饱和电流(Isat)达16A(定义为电感值下降30%时的电流),是该产品的核心优势之一。大电流场景下,电感若饱和会导致滤波效果失效、纹波增大,甚至损坏电路;16A的饱和电流可覆盖服务器电源、车载电源等典型场景的峰值电流(通常需留20%余量,实际可用至12.8A左右),确保电路稳定运行。
直流电阻仅15.4mΩ,远低于同类常规功率电感(部分产品DCR超20mΩ)。低DCR直接降低铜损(功率损耗P=I²×DCR),例如在10A工作电流下,损耗仅为1.54W,可显著减少设备发热,提升电源转换效率(效率提升约1%-2%),延长设备使用寿命。
采用SMD贴片封装,尺寸为7.8×7.6mm(平面尺寸),体积紧凑,适合高密度集成设计(如服务器主板、小型化电源模块)。一体成型结构无磁芯外露,可降低电磁干扰(EMI)辐射,减少对周边电路的影响,简化EMI设计。
磁芯与线圈一体化注塑封装,避免传统绕线电感的磁芯碎裂问题,抗振动(符合MIL-STD-202振动标准)、抗冲击性能优异,适合车载、工业等恶劣环境应用。
优化的磁芯材料(低磁损)+ 低DCR线圈,双重降低功率损耗。实测在12A连续电流下,表面温升仅约30℃(环境温度25℃),无需额外散热设计,节省成本与空间。
工作温度范围覆盖-40℃至+125℃(益嘉源同类产品常规参数),适配极端环境下的电源设计(如户外通信设备、车载低温场景)。
该产品凭借高饱和电流、低损耗、紧凑封装等优势,在中大功率电源领域具有较强的性价比,是电源设计工程师的实用选型之一。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products