Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
YNR5040-2R2N是益嘉源(YJYCOIN)推出的小型化SMD磁胶屏蔽功率电感,采用5×5×4mm标准贴片封装,专为中小功率直流电源电路设计——兼顾低损耗、小体积与电磁兼容特性,可满足消费电子、小型电源模块等场景的储能、滤波与EMI抑制核心需求,是替代同规格进口电感的高性价比选择。
标称电感值2.2μH,精度±30%:
功率电感因工作在大电流、低频率场景,对电感值精度要求低于信号电感(信号电感通常需±5%~±10%)。±30%的精度可有效控制成本,同时满足电源纹波抑制的基本需求(电源电路中,电感值小偏差对输出纹波影响可通过电容补偿)。
3.8A(连续工作电流):
该参数指电感在25℃环境温度下,连续工作时电感值变化不超过10%的最大电流。实际饱和电流(电感磁芯饱和时的临界电流)通常高于额定电流,可覆盖10W~20W功率段的电源电路(如12V转5V/3A的快充模块)。
19mΩ:
低DCR是功率电感的核心优势——电流通过时的热损耗((P=I^2R))显著降低,可提升电源转换效率(每100mΩDCR在3A电流下损耗0.9W,19mΩ仅损耗0.17W),同时减少设备发热,延长电路寿命。
5×5×4mm SMD:
标准贴片封装适配自动化贴装设备,焊接可靠性高;小体积节省PCB布局空间,适合高密度集成设计(如手机快充适配器、路由器电源模块)。
采用一体化磁胶屏蔽设计:通过磁胶包裹磁芯,有效抑制电感工作时的电磁辐射,降低对周边电路的干扰,满足EMC(电磁兼容)要求(如车载电子、医疗设备等对电磁干扰敏感的场景)。
选用铁氧体磁芯,兼顾电感量稳定性与电流承载能力:避免大电流下的磁饱和现象,同时减少磁芯损耗(磁损+铜损),进一步提升效率。
无引脚SMD封装,抗振动性能优于传统插件电感(通过振动测试:10~2000Hz,加速度1g),适用于移动设备(如笔记本电脑)、车载设备等易受振动的场景。
益嘉源(YJYCOIN)作为专注电感研发生产的品牌,YNR5040-2R2N通过多项可靠性测试:
产品可直接替代TDK、村田等同规格电感,降低采购成本30%以上,同时保障性能一致性。
YNR5040-2R2N以“小体积、低损耗、高EMC”为核心优势,是中小功率电源电路的高性价比选择。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products