WMSIC Electronic Components

YPK0608-222K

ModelYPK0608-222K
PackageThrough-hole
BrandYJYCOIN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YJYCOIN YPK0608-222K
Type
YJYCOIN
Minimum package
500 袋

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YJYCOIN
Electronic Component
YPK0608-222K
Electronic Component
1
Package
Through-hole
Type
Inductor
Electronic Component
Power Inductor
Electronic Component
±10%
Electronic Component
1.24g
Inductor
2.2mH
Electronic Component
1
Electronic Component
BM0266128063
Current
130mA
Resistor(DCR)
8Ω
Electronic Component
Electronic Component
Electronic Component
500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

YPK0608-222K 工字插件功率电感产品概述

一、产品核心身份与定位

YPK0608-222K是益嘉源电子(YJYCOIN)推出的插件式工字功率电感,针对小功率直流/开关电路的储能、滤波及EMI抑制需求设计。区别于贴片电感的自动化适配性,该产品采用插件封装,具备手工焊接友好、原型开发便捷的特点,同时兼顾成本控制与性能稳定性,适用于中小批量生产及实验验证场景。

二、基础参数全解析

该电感核心参数明确适配小功率应用,具体如下:

  • 电感值:2.2mH(标识“222”,即22×10²μH=2200μH=2.2mH),精度±10%,满足常规电路对电感偏差的要求;
  • 电流规格:额定电流(Irms)130mA(长期稳定工作的最大允许电流,此时电感温度上升控制在行业常规范围),饱和电流(Isat)130mA(电感值下降至初始值70%时的电流阈值,需严格控制工作电流不超此值,避免性能衰减);
  • 直流电阻(DCR):8Ω,反映绕线直流损耗——小功率场景下(电流≤130mA),损耗功率仅约0.136W,对整体电路效率影响极小;
  • 结构封装:工字铁氧体磁芯,插件封装(引脚间距符合常规PCB设计规范),无屏蔽设计但磁场集中性优于空芯电感,对外辐射干扰较低。

三、结构与工艺特点

  1. 磁芯与绕线:采用铁氧体工字磁芯,磁导率适中,中低频(10kHz-100kHz)损耗低;绕线为高强度漆包线,匝数精准保证电感一致性,绕制后经环氧树脂包封,增强机械强度并防止磁芯碎裂;
  2. 引脚处理:插件引脚采用镀锡工艺,焊接润湿性好,可避免虚焊,适合手工焊接或波峰焊;
  3. 成本平衡:工字结构简化生产工艺,相比屏蔽功率电感成本更低,同时满足小功率电路的储能需求,适合预算有限的应用。

四、典型应用场景

YPK0608-222K因参数适配性强,广泛用于以下小功率电路:

  1. 小功率开关电源:如5V/0.5A以下的手机充电器、小型路由器电源,作为输出滤波电感抑制纹波,提升电源稳定性;
  2. 音频电路滤波:功放电源滤波环节,减少纹波对音频信号的干扰,提升音质;
  3. 单片机外围电路:MCU电源稳压后的滤波电感,或时钟电路的EMI抑制元件,降低电磁干扰对MCU的影响;
  4. 小型LED驱动:5-10颗LED灯串的驱动电路,利用电感储能实现恒流输出;
  5. 原型开发:电子爱好者/研发人员的实验板、原型机,插件封装便于快速焊接与更换,适合电路调试。

五、选型与使用注意事项

为保证性能稳定,需注意以下几点:

  1. 电流限制:工作电流不得超过130mA,避免磁饱和导致电感值下降;
  2. 焊接规范:手工焊接温度≤350℃、时间≤3秒,波峰焊温度≤260℃、时间≤5秒,防止磁芯开裂或漆包线绝缘损坏;
  3. 温度范围:常规工作温度-40℃至+85℃,避免靠近发热元件(如功率管);
  4. PCB布局:尽量靠近负载/滤波节点,减少走线长度,降低寄生电感/电阻影响;
  5. 对比选型:若需更高电流(≥200mA),需选额定电流更大的电感;若需更小体积,可考虑贴片电感,但插件更适合手工操作。

该产品凭借“小功率适配+插件便捷性+成本优势”,成为原型开发、小批量生产及入门级电路的理想选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.