WMSIC Electronic Components

XC6206P182MR

ModelXC6206P182MR
PackageSOT-23
BrandYONGYUTAI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YONGYUTAI XC6206P182MR
Type
YONGYUTAI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
150mV@(30mA)
Electronic Component
YONGYUTAI
Electronic Component
XC6206P182MR
Electronic Component
1
Package
SOT-23
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.036g
Electronic Component
1
Electronic Component
BM0228560657
Operating Temperature
40℃~+125℃@(Tj)
Operating Voltage
6V
Output
Electronic Component
Output Voltage
1.8V
Output Current
250mA
Output Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XC6206P182MR 产品概述

一、产品简介

XC6206P182MR 是一款固定输出、正极性线性稳压器(LDO),由 YONGYUTAI(永裕泰)提供,面向低功耗和空间受限的电子系统。器件输入工作电压 6V,输出电压固定为 1.8V,单通道输出,最大输出电流可达 250mA。器件具备过流保护功能,工作结温范围为 -40℃ 到 +125℃,静态电流仅 1µA,适合电池供电与便携式设备等需要低静态电流的场合。标准 SOT-23 封装便于表面贴装与小型化设计。

二、主要特性

  • 固定输出:1.8V,正极性输出,单通道
  • 工作电压:6V(输入端)
  • 最大输出电流:250mA(短时或在充足散热条件下)
  • 低静态电流:Iq = 1µA,延长电池寿命
  • 低压差:150mV @ 30mA(典型值);高电流时压差会相应上升
  • 保护功能:内置过流保护,提升系统可靠性
  • 工作温度:-40℃ ~ +125℃(Tj)
  • 封装形式:SOT-23,小尺寸易布局

三、典型应用

  • 便携式和电池供电设备(例如手持终端、可穿戴设备)
  • 工业控制与传感器模块的 1.8V 供电轨
  • 嵌入式系统、微控制器和数字芯片电源
  • 通信设备、低功耗传感节点

四、使用建议与注意事项

  • 输出电容:为确保稳定性与瞬态响应,建议在靠近输出引脚处配置低 ESR 的陶瓷电容,常见值 1µF~10µF,根据系统负载与布线选择。
  • 输入电容:在输入端也应放置去耦电容以抑制输入导线感应与瞬态。
  • 散热管理:器件功耗等于 (Vin – 1.8V) × Iout。高负载或高差压时产生较大热量,应通过合理布铜与散热路径设计、必要时限制连续输出电流来防止过热。
  • 保护行为:过流保护会在异常时限制输出电流,可能导致输出电压下降或发生热关断,设计时需考虑启动与短路情形。
  • 电压裕量:保证实际输入电压高于 1.8V 加上工作压差;在高电流条件下需预留更多裕量以维持稳定输出。
  • 布局要点:尽量缩短电容到 LDO 的连线,输入、输出与地线保持低阻抗路径以提升稳定性与抑制噪声。

五、封装与可靠性信息

SOT-23 小封装适合 PCB 面积受限应用,焊接工艺成熟且成本低。器件在工业温度范围内工作可靠,但在高功耗场合需关注结温与板级散热。典型设计应参考厂商完整规格书以获得绝对最大额定值、热阻参数和典型性能曲线,确保在应用条件下满足长期可靠性。

总结:XC6206P182MR 以超低静态电流、适度输出能力和小型封装优势,适合对功耗和板面空间敏感的 1.8V 电源设计;在高负载或高压差应用中,需要合理的散热与布局设计以保证稳定运行。

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