WMSIC Electronic Components

YONGYUTAI SI2305

ModelSI2305
PackageSOT-23
BrandYONGYUTAI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YONGYUTAI SI2305
Type
YONGYUTAI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YONGYUTAI
Electronic Component
SI2305
Electronic Component
1
Package
SOT-23
Electronic Component
1 P
Type
P
Electronic Component
MOSFET
Electronic Component
0.031g
Electronic Component
1
Electronic Component
BM0225995903
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
1.2W
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
20V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SI2305 产品概述

概要

SI2305 是由永裕泰(YONGYUTAI)生产的一款高性能场效应管(MOSFET),属于P沟道类型,适用于各种电子设备中的开关和功率管理应用。以下是对该产品的详细介绍。

基础参数

  • 功率(Pd): 1.2W
  • 商品分类: 场效应管(MOSFET)
  • 导通电阻(RDS(on)@Vgs, Id): 65mΩ @ 4.5V, 3.9A
  • 工作温度: -55℃ ~ +150℃
  • 漏源电压(Vdss): 20V
  • 类型: 1个P沟道
  • 输入电容(Ciss@Vds): 750pF @ 10V
  • 连续漏极电流(Id): 3.9A
  • 阈值电压(Vgs(th)@Id): 1.5V @ 250uA

封装和品牌

  • 封装: SOT-23
  • 品牌: 永裕泰(YONGYUTAI)

性能特点

低导通电阻

SI2305 具有非常低的导通电阻(RDS(on)),仅为 65mΩ @ 4.5V, 3.9A。这意味着在开启状态下,通过MOSFET的电流会产生很少的热量和能量损失,提高了整体系统的效率和可靠性。

宽工作温度范围

该MOSFET能够在广泛的温度范围内工作, 从-55℃到+150℃。这种特性使其适用于各种极端环境下的应用,例如汽车电子、工业控制和航空航天等领域。

高漏源电压

SI2305 的漏源电压(Vdss)为 20V,这使得它能够承受较高的电压,提高了其在高压应用中的可靠性和安全性。

高连续漏极电流

该MOSFET支持高达 3.9A 的连续漏极电流,这使得它能够处理较大的电流负载,适用于需要高功率输出的应用。

低阈值电压

阈值电压(Vgs(th))为 1.5V @ 250uA,这意味着驱动该MOSFET所需的门源电压较低,简化了驱动电路的设计,并减少了能耗。

应用场景

电源管理

SI2305 可以用于各种电源管理系统,例如DC-DC转换器、电池管理系统和电源开关等。其低导通电阻和高连续漏极电流使其特别适合于高效能和高功率的应用。

汽车电子

由于其宽工作温度范围和高可靠性,SI2305 非常适合用于汽车电子系统,如启动系统、燃油喷射系统以及其他需要在恶劣环境下运行的设备。

工业控制

在工业控制领域,SI2305 可以用于驱动大型电机、控制阀门以及其他需要高功率和高可靠性的设备。

消费电子

在消费电子产品中,如笔记本电脑、平板电脑和智能手机等,SI2305 可以用于功率管理模块,提高整体系统的效率和续航时间。

设计考虑

热管理

由于MOSFET在工作过程中会产生热量,设计人员需要考虑如何有效地散热。可以通过增加散热片、使用导热胶或优化PCB布局来提高散热效率。

驱动电路

由于SI2305 的低阈值电压,驱动电路的设计相对简单。但是,仍需要确保驱动信号的稳定性和噪声抑制,以避免不必要的开关噪声和能量损失。

电磁兼容性

在设计时,需要考虑电磁兼容性(EMC)问题。可以通过添加滤波器、屏蔽和地线布局优化来减少EMI(电磁干扰)。

总结

SI2305 是一款高性能、低导通电阻、宽工作温度范围的P沟道MOSFET,非常适合于各种需要高效能和高可靠性的应用。其优异的参数和广泛的适用场景使其成为许多设计工程师的首选元器件。通过合理的设计和布局,SI2305 可以帮助实现高效、可靠和稳定的电子系统。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.