WMSIC Electronic Components

YONGYUTAI MB10F

ModelMB10F
PackageMBF
BrandYONGYUTAI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YONGYUTAI MB10F
Type
YONGYUTAI
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YONGYUTAI
Electronic Component
MB10F
Electronic Component
1
Package
MBF
Type
Electronic Component
Electronic Component
Bridge Rectifier
Electronic Component
0.143g
Electronic Component
1
Electronic Component
BM0226337732
Current
800mA
Current(Ir)
5uA@1kV
(Vf)
1.1V@1A
Electronic Component
55℃~+150℃@(Tj)
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MB10F 产品概述

一、产品简介

MB10F 是永裕泰(YONGYUTAI / 永裕泰)推出的一款单相整流桥,适用于中低功率交流到直流的整流场合。器件采用 MBF 塑封封装,具有高耐压、低反向泄漏和较好的浪涌承受能力,适合商业与工业类小型电源、监控、家电控制板等应用。

二、主要技术参数

  • 类型:单相桥式整流
  • 正向压降 (Vf):1.1 V @ 1 A
  • 直流整流电流 (Io):800 mA(持续)
  • 非重复峰值浪涌电流 (Ifsm):35 A
  • 直流反向耐压 (Vr):1000 V
  • 反向电流 (Ir):5 μA @ 1 kV
  • 工作结温范围:-55 ℃ ~ +150 ℃
  • 封装:MBF(塑封,通孔安装友好)

三、电气性能与实际影响

  • 高耐压(1 kV):适合高电压整流或带较大瞬时反向电压的场合,能在较严苛的输入侧条件下工作。
  • 低反向泄漏(5 μA @ 1 kV):在高压微小电流场景(例如高压偏置或测量电路)中有优势,降低漏电带来的能耗与误差。
  • 正向压降 1.1 V:在桥式整流时任意时刻有两只二极管导通,总压降约 2.2 V(@1 A),对功耗和发热有直接影响。举例:在 Io = 0.8 A 时,整流桥上的平均功耗约 P = 2 × Vf × Io ≈ 1.76 W,需关注散热。
  • 峰值浪涌 35 A:允许短时间充电或浪涌电流,但应避免频繁或长时间峰值冲击以延长寿命。

四、封装与热管理

MBF 塑封封装适合通孔安装,便于波峰焊和手工焊接。尽管额定整流电流为 800 mA,实际使用中应注意散热管理:

  • 在 PCB 设计中增加焊盘铜箔面积和过孔以改善散热;
  • 保持器件周围良好通风,避免在高温环境下长时间满载;
  • 对于有较大浪涌或持续接近额定电流的应用,建议采用外部散热片或更大功率器件。

如需精确热分析,请参考完整数据手册中的热阻参数与结温上升曲线。

五、典型应用

  • 小功率开关电源、适配器前端整流;
  • 工业控制、自动化设备的辅助电源;
  • 家电控制板(显示、控制逻辑电源);
  • LED 驱动、充电器及一般直流偏置电路。

六、使用建议与保护措施

  • 设计中加入保险丝或自恢复保险元件防止长期过流;
  • 对输入包含电容充放电的电源,配合 NTC 或限流电路以控制峰值冲击;
  • 在需要抑制瞬态的场合并联 TVS 二极管或 RC 缓冲网络,保护器件不被反向过压或高频尖峰损坏;
  • 注意极性标识,避免反向接入导致器件损坏;工作中应满足额定结温范围并做适当降额处理。

七、结语

MB10F(YONGYUTAI / 永裕泰,封装 MBF)以其 1 kV 耐压、低漏电、良好浪涌能力及便捷封装,适合各种中低功率高压整流场景。选型与设计时建议参考厂家完整数据手册获取外形尺寸、热阻和典型特性曲线,以便做可靠的热管理和电气保护方案。若需数据手册或 PCB 尺寸图,可提供进一步下载链接或技术资料。

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